The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering

Y.S. Huang; H.Y. Hsiao; Chih Chen; K.N. Tu

doi:10.1016/j.scriptamat.2012.01.046

Author(s)

Y.S. Huang
H.Y. Hsiao
Chih Chen
K.N. Tu

Detail(s)

Original language	English
Pages (from-to)	741-744
Journal / Publication	Scripta Materialia
Volume	66
Issue number	10
Publication status	Published - May 2012
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1016/j.scriptamat.2012.01.046 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-84862803844&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(c7fdcb23-75c7-46ef-ad66-ea185ab5a343).html

Abstract

We report new findings in Ni/SnAg-solder/Cu microbumps having a reduced solder thickness in the range of 40-10 μm; the growth rate of the intermetallic compounds depends strongly on the solder thickness. In the Ni/40 μm solder/Cu samples, the compound which grew on the Ni side grew slightly faster than that on the Cu side. However, the growth reverses as the solder thickness decreases below 20 μm due to the change in Cu and Ni concentration gradients in the solder. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Research Area(s)

Copper, Diffusion, Intermetallic compounds, Nickel, Soldering

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Citation Format(s)

[ RIS ] [ BibTeX ]

The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering. / Huang, Y.S.; Hsiao, H.Y.; Chen, Chih et al.
In: Scripta Materialia, Vol. 66, No. 10, 05.2012, p. 741-744.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Huang, YS, Hsiao, HY, Chen, C & Tu, KN 2012, 'The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering', Scripta Materialia, vol. 66, no. 10, pp. 741-744. https://doi.org/10.1016/j.scriptamat.2012.01.046

Huang, Y. S., Hsiao, H. Y., Chen, C., & Tu, K. N. (2012). The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering. Scripta Materialia, 66(10), 741-744. https://doi.org/10.1016/j.scriptamat.2012.01.046

Huang YS, Hsiao HY, Chen C, Tu KN. The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering. Scripta Materialia. 2012 May;66(10):741-744. doi: 10.1016/j.scriptamat.2012.01.046

Huang, Y.S. ; Hsiao, H.Y. ; Chen, Chih et al. / The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering. In: Scripta Materialia. 2012 ; Vol. 66, No. 10. pp. 741-744.