The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering

Y.S. Huang; H.Y. Hsiao; Chih Chen; K.N. Tu

doi:10.1016/j.scriptamat.2012.01.046

The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering

Y.S. Huang, H.Y. Hsiao, Chih Chen^*, K.N. Tu

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

47 Citations (Scopus)

Abstract

We report new findings in Ni/SnAg-solder/Cu microbumps having a reduced solder thickness in the range of 40-10 μm; the growth rate of the intermetallic compounds depends strongly on the solder thickness. In the Ni/40 μm solder/Cu samples, the compound which grew on the Ni side grew slightly faster than that on the Cu side. However, the growth reverses as the solder thickness decreases below 20 μm due to the change in Cu and Ni concentration gradients in the solder. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Original language	English
Pages (from-to)	741-744
Journal	Scripta Materialia
Volume	66
Issue number	10
DOIs	https://doi.org/10.1016/j.scriptamat.2012.01.046
Publication status	Published - May 2012
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

Copper
Diffusion
Intermetallic compounds
Nickel
Soldering

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title = "The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering",

abstract = "We report new findings in Ni/SnAg-solder/Cu microbumps having a reduced solder thickness in the range of 40-10 μm; the growth rate of the intermetallic compounds depends strongly on the solder thickness. In the Ni/40 μm solder/Cu samples, the compound which grew on the Ni side grew slightly faster than that on the Cu side. However, the growth reverses as the solder thickness decreases below 20 μm due to the change in Cu and Ni concentration gradients in the solder. {\textcopyright} 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.",

keywords = "Copper, Diffusion, Intermetallic compounds, Nickel, Soldering",

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AU - Huang, Y.S.

AU - Hsiao, H.Y.

AU - Chen, Chih

AU - Tu, K.N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2012/5

Y1 - 2012/5

N2 - We report new findings in Ni/SnAg-solder/Cu microbumps having a reduced solder thickness in the range of 40-10 μm; the growth rate of the intermetallic compounds depends strongly on the solder thickness. In the Ni/40 μm solder/Cu samples, the compound which grew on the Ni side grew slightly faster than that on the Cu side. However, the growth reverses as the solder thickness decreases below 20 μm due to the change in Cu and Ni concentration gradients in the solder. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

AB - We report new findings in Ni/SnAg-solder/Cu microbumps having a reduced solder thickness in the range of 40-10 μm; the growth rate of the intermetallic compounds depends strongly on the solder thickness. In the Ni/40 μm solder/Cu samples, the compound which grew on the Ni side grew slightly faster than that on the Cu side. However, the growth reverses as the solder thickness decreases below 20 μm due to the change in Cu and Ni concentration gradients in the solder. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

KW - Copper

KW - Diffusion

KW - Intermetallic compounds

KW - Nickel

KW - Soldering

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DO - 10.1016/j.scriptamat.2012.01.046

M3 - RGC 21 - Publication in refereed journal

SN - 1359-6462

VL - 66

SP - 741

EP - 744

JO - Scripta Materialia

JF - Scripta Materialia

IS - 10

ER -

The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering

Abstract

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Research Keywords

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