The application of lead-free solder to optical fiber packaging
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 1440-1444 |
| Journal / Publication | Journal of Electronic Materials |
| Volume | 33 |
| Issue number | 12 |
| Publication status | Published - Dec 2004 |
| Externally published | Yes |
Link(s)
Abstract
To achieve precise, hermetic, and reliable optoelectronic packaging, we studied a novel technology for bonding fibers to v-grooved chips by metallic soldering. Multilayered metallization of Ti/Au, Ti/Cu/Au, or Ti/Ni/Au has been prepared to improve the poor bonding nature of solder on oxide surface. The eutectic 43Sn57Bi (wt.%) alloy, having a melting point of 139°C, was selected to bond the fibers to v-grooved chips. The alignment and adhesion tests result show that the precision packaging by soldering has a satisfied reliability in the range of working temperature from -40°C to 85°C. The metallic solder bonding is hermetic, and hence, it can isolate the optical device from ambient environment.
Research Area(s)
- Lead-free solder, Optical and optoelectronic packaging, Optical fiber array, V-grooved chips
Bibliographic Note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
Citation Format(s)
The application of lead-free solder to optical fiber packaging. / Ou, Shengquan; Xu, Gu; Xu, Yuhuan et al.
In: Journal of Electronic Materials, Vol. 33, No. 12, 12.2004, p. 1440-1444.
In: Journal of Electronic Materials, Vol. 33, No. 12, 12.2004, p. 1440-1444.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
