Temperature-dependent plastic deformation mechanisms of a Cu/steel transforming nanolamellar composite

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

3 Scopus Citations
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Author(s)

  • Y. Ru
  • K. Y. Yu
  • F. Guo
  • Y. Ren
  • L. Cui

Detail(s)

Original languageEnglish
Pages (from-to)77-84
Journal / PublicationMaterials Science and Engineering A
Volume734
Publication statusPublished - 12 Sept 2018
Externally publishedYes

Abstract

Metallic nanolamellar composites possess unusually high strength owing to the high density interfaces that impede dislocation nucleation and migration. Meanwhile most nanolamellar composites show limited ductility in tension due to the lack of effective deformation mechanisms. Martensitic transformation, once multiplied with dislocations, can improve the work hardening efficiently during plastic deformation, leading to enhanced ductility. It is thereby of interest to investigate the mechanical behavior of nanolamellar composites that contain martensitic constituents. We here report on the temperature-dependent deformation mechanisms of a nanolamellar Cu/carbon-steel composite wire with a high volume fraction of retained austenite. Tensile tests at various temperatures reveal that the mechanical behavior of the composite is sensitive to temperature, analogous to the feature of deformation-induced martensitic transformation in steels with mechanically metastable austenite. In particular, a maximum uniform elongation of 63% is achieved at 180 °C. In situ synchrotron X-ray studies suggest that the deformation mechanisms of the composite are a result of the competition between transformation and slip of the retained austenite. A deformation mechanism map is proposed and the boundary between stress- and strain-induced martensitic transformation is clearly identified.

Research Area(s)

  • In situ synchrotron X-ray diffraction, Martensitic transformation, Retained austenite, Transforming nanolamellar composite

Bibliographic Note

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