Temperature Effect on Interfacial Creep Behavior in Bonded Material System

Molecular dynamics (MD) method has been proved to be a powerful tool for the study of interfacial behavior under different conditions at microscale. The objectives of this work is to characterize the interfacial creep behavior at microscale and to investigate the effect of high temperature by MD simulations in epoxy-silica bilayered material system. From simulation results, the threshold stresses for the creep behavior under different temperature levels are obtained, and the interfacial creep behavior under constant loading is explored. In addition, the results provide insight to predict the interfacial behavior of bilayered material system under sustaining loading in high temperature conditions.