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Synthesis of bismaleimide resin containing the poly(ethylene glycol) side chain: Curing behavior and thermal properties

  • K. S. Chian
  • , X. Y. Du
  • , H. A. Goy
  • , J. L. Feng
  • , S. Yi
  • , C. Y. Yue

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Abstract

Two maleimido end-capped poly(ethylene glycol) (m-PEG) of different molecular weights were synthesized and blended at various proportions with bismaleimide resin (4,4′-bismaleimido diphenylmethane) (BDM). The curing behavior and the thermal properties of the m-PEG/BDM blends were studied and presented here. It was found that the addition of m-PEG enhanced the processability of the BDM resin significantly. The processing window of the BDM resin was increased from approximately 20 to 80°C. The addition of m-PEG modified resins, however, resulted not only in the reduction in the thermal stability of the blended BDM resin but also elevation of the coefficients of thermal expansion. The changes in thermal/mechanical properties of the blends were found to be proportional to the amounts of m-PEG incorporated. It was observed that the curing behavior, and thermal and mechanical properties, of the blends were independent of the molecular weight of the PEG segment.
Original languageEnglish
Pages (from-to)2935-2945
JournalJournal of Applied Polymer Science
Volume85
Issue number14
DOIs
Publication statusPublished - 29 Sept 2002
Externally publishedYes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

  • Bismaleimide
  • Graft
  • Poly(ethylene glycol)
  • Thermal properties

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