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Synthesis of aluminum nitride films by plasma immersion ion implantation-deposition using hybrid gas-metal cathodic arc gun

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Abstract

    The aluminum nitride films were deposited on silicon wafers (100) by metal plasma immersion ion implantation and deposition (PIIID) using a modified hybrid gas-metal cathodic arc plasma source. By feeding the gas into the arc discharge region, the mixed metal and gaseous plasma was generated. It was shown that the compositions, microstructures and crystal states of the deposited films are quite stable and remain unchanged after annealing at 800 °C for 1 h. The results show that the hybrid gas-metal source cathodic arc source delivers better AlN thin films than conventional PIIID employing dual plasma.
    Original languageEnglish
    Pages (from-to)719-724
    JournalReview of Scientific Instruments
    Volume75
    Issue number3
    DOIs
    Publication statusPublished - Mar 2004

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