Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton

Albert T. Wu; N. Tamura; J. R. Lloyd; C. R. Kao; K. N. Tu

doi:10.1557/proc-863-b9.10

Author(s)

Albert T. Wu
N. Tamura
J. R. Lloyd
C. R. Kao
K. N. Tu

Detail(s)

Original language	English
Article number	B9.10
Pages (from-to)	363-367
Journal / Publication	Materials Research Society Symposium Proceedings
Volume	863
Publication status	Published - 2005
Externally published	Yes

Conference

Title	2005 Materials Research Society Spring Meeting
Place	United States
City	San Francisco, CA
Period	28 March - 1 April 2005

Link(s)

DOI	DOI https://doi.org/10.1557/proc-863-b9.10 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-28844455057&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(733ad7ef-f51b-4b5f-8d91-082bf7539160).html

Abstract

White Sn (ß-Sn) thin film stripe shows a voltage drop about 10% when subjected to electromigration testing. Since ß-Sn has anisotropic crystal structure, it possesses different resistivity along a-, b- and c axis. The direction of the axes determines the resistance in each grain. Under electromigration, low resistance grain tends to grow in the expense of the neighboring high resistance grains. The changes of grain orientation in the Sn stripe before and after electromigration was studied by synchrotron x-ray microdiffraction (~lnm diameter) to achieve grain-by-grain analysis. Grain growth involves grain boundary migration and rotation of neighboring high resistance grains. A model different from normal grain growth is proposed to describe the condition and mechanism of microstructural evolution under electromigration. © 2005 Materials Research Society.

Bibliographic Note

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Citation Format(s)

[ RIS ] [ BibTeX ]

Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton. / Wu, Albert T.; Tamura, N.; Lloyd, J. R. et al.
In: Materials Research Society Symposium Proceedings, Vol. 863, B9.10, 2005, p. 363-367.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Wu, AT, Tamura, N, Lloyd, JR, Kao, CR & Tu, KN 2005, 'Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton', Materials Research Society Symposium Proceedings, vol. 863, B9.10, pp. 363-367. https://doi.org/10.1557/proc-863-b9.10

Wu, A. T., Tamura, N., Lloyd, J. R., Kao, C. R., & Tu, K. N. (2005). Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton. Materials Research Society Symposium Proceedings, 863, 363-367. Article B9.10. https://doi.org/10.1557/proc-863-b9.10

Wu AT, Tamura N, Lloyd JR, Kao CR, Tu KN. Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton. Materials Research Society Symposium Proceedings. 2005;863:363-367. B9.10. doi: 10.1557/proc-863-b9.10

Wu, Albert T. ; Tamura, N. ; Lloyd, J. R. et al. / Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton. In: Materials Research Society Symposium Proceedings. 2005 ; Vol. 863. pp. 363-367.