Abstract
This paper addresses the compaction of IC layouts subjected to conditional spacing rules in multiple-level metal technology. The constraints imposed by conditional rules make the automatic compaction of layout much more difficult than when the usual minimum separation rules are applied. To solve the problem, we first formulate each conditional spacing rule with a set of arcs in the constraint graph representation. We prove that finding the optimal solution under one bridge rule is NP-complete. We then propose a graph-theory method of compaction which, by reducing the problem size, can efficiently obtain an optimal solution. © 1992 IEEE
| Original language | English |
|---|---|
| Pages (from-to) | 475-486 |
| Journal | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems |
| Volume | 11 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - Apr 1992 |
| Externally published | Yes |
Bibliographical note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].Funding
Manuscript received August 7, 1990; revised February 25, 1991. This work was funded in part by a grant from the NSF (Project MIP-9009260) and by grants from Amdahl, AT&T, Cadence, Elite, and Hughes under MICRO. This paper was recommended by Associate Editor M. Marek-Sadowska. C.-K. Cheng and S.-Z. Yao are with the Department of Computer Science and Engineering, University of California at San Diego, La Jolla, CA 92093. X. Deng is with the School of Computing Science, Simon Fraser University, Burnaby, BC V5AlS6. Y.-Z. Liao is with ArcSys, Inc., 3080 Olcott Street, Suite 120A, Santa Clara, CA 95054. IEEE Log Number 9104583.
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