Sustainable glucose-based phenolic resin and its curing with a DGEBA epoxy resin
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 381-387 |
Journal / Publication | Journal of the Taiwan Institute of Chemical Engineers |
Volume | 71 |
Publication status | Published - 1 Feb 2017 |
Externally published | Yes |
Link(s)
Abstract
A sustainable novolac-type resin – phenol–hydroxymethylfurfural (PHMF) resin was prepared by reacting phenol with HMF, in-situ derived from glucose, at 120 °C by acid catalysis. Bisphenol A type epoxy resin, i.e. bisphenol A diglycidyl ether (DGEBA), was used as a formaldehyde-free curing agent by substituting conventional formaldehyde-based hexamethylene tetraamine (HMTA) to crosslink the PHMF resin. Curing mechanism was probed and the curing proceeded likely with the ring opening reaction between the DGEBA and reactive hydroxyl groups. DGEBA not only made this system truly formaldehyde-free but also helped form a void-free matrix which is an important merit for composites. The kinetic parameters of the curing reaction were evaluated with model-free and model-fitting methods using exothermal peak data from the curing process. The thermo-mechanical characterization of the cured resin and fiber reinforced bio-composites showed good heat resistance and mechanical performance, suggesting its potential for producing void- and formaldehyde-free composite materials. © 2016 Taiwan Institute of Chemical Engineers
Research Area(s)
- Curing kinetics, DGEBA epoxy resin, Phenol–hydroxymethylfurfural resin, Properties, Renewable polymer, Thermal stability
Bibliographic Note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
Citation Format(s)
Sustainable glucose-based phenolic resin and its curing with a DGEBA epoxy resin. / Zhang, Yongsheng; Ferdosian, Fatemeh; Yuan, Zhongshun et al.
In: Journal of the Taiwan Institute of Chemical Engineers, Vol. 71, 01.02.2017, p. 381-387.
In: Journal of the Taiwan Institute of Chemical Engineers, Vol. 71, 01.02.2017, p. 381-387.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review