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Surface Metallization of Glass Fiber (GF) / Polyetheretherketone (PEEK) Composite with Cu Coatings Deposited by Magnetron Sputtering and Electroplating

  • Li Zhong
  • , Fanya Jin*
  • , Paul K. Chu*
  • , Honghui Tong
  • , Min Dan
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

Surface metallization of glass fiber (GF) / polyetheretherketone (PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction (XRD), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD). The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998. The results show that the Cu coating with a thickness of 30 µm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress, bonding strength, and electrical conductivity than the Cu coating deposited by electroplating. © 2024, Wuhan University of Technology and Springer-Verlag GmbH Germany, Part of Springer Nature.
Original languageEnglish
Pages (from-to)213-220
Number of pages8
JournalJournal Wuhan University of Technology, Materials Science Edition
Volume39
Issue number1
Online published17 Jan 2024
DOIs
Publication statusPublished - 1 Feb 2024

Funding

Funded by Shenzhen - Hong Kong Innovative Collaborative Research and Development Program (Nos.SGLH20181109 110802117, CityU 9240014), Innovation Project of Southwestern Institute of Physics (Nos.202001XWCXYD002, 202301XWCX003) and CNNC Young Talent Program (No.2023JZYF-01)

Research Keywords

  • Cu coating
  • electroplating
  • magnetron sputtering
  • surface metallization

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