Summary Abstract: Current metallization issues in microelectronic devices

K. N. Tu

doi:10.1116/1.572726

Summary Abstract: Current metallization issues in microelectronic devices

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Original language	English
Pages (from-to)	216-217
Journal	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume	2
Issue number	2
DOIs	https://doi.org/10.1116/1.572726
Publication status	Published - Apr 1984
Externally published	Yes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Summary Abstract: Current metallization issues in microelectronic devices",

author = "Tu, {K. N.}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

year = "1984",

month = apr,

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language = "English",

volume = "2",

pages = "216--217",

journal = "Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films",

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PY - 1984/4

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DO - 10.1116/1.572726

M3 - RGC 21 - Publication in refereed journal

SN - 0734-2101

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JO - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

JF - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

IS - 2

ER -

Summary Abstract: Current metallization issues in microelectronic devices

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