Substrate-Integrated Device And Method for Making The Same

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

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Detail(s)

Original languageEnglish
Patent numberUS10,856,408
Filing number16/502,125
Publication status
  • Accepted/In press/Filed - 3 Jul 2019
  • Published - 1 Dec 2020

Citation Format(s)

Substrate-Integrated Device And Method for Making The Same. / LEE, Wai Ki (Inventor); LEUNG, Kwok Wa (Inventor); KREMER, Hauke Ingolf (Inventor).

Patent No.: US10,856,408. Dec 01, 2020.

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)