Substrate-Integrated Device And Method for Making The Same
Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)
Author(s)
Related Research Unit(s)
Detail(s)
Original language | English |
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Patent number | US10,856,408 |
Filing number | 16/502,125 |
Publication status |
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Link(s)
Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(ed369407-76bb-4e4f-a7a6-b086c95a5ad7).html |
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Citation Format(s)
Substrate-Integrated Device And Method for Making The Same. / LEUNG, Kwok Wa (Inventor); LEE, Wai Ki (Inventor); KREMER, Hauke Ingolf (Inventor).
Patent No.: US10,856,408. Dec 01, 2020.
Patent No.: US10,856,408. Dec 01, 2020.
Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)