Substrate-Integrated Device And Method for Making The Same

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

Overview

View graph of relations

Author(s)

Kwok Wa LEUNG (Inventor)
Wai Ki LEE (Inventor)
Hauke Ingolf KREMER (Inventor)

Related Research Unit(s)

Department of Electrical Engineering

Detail(s)

Original language	English
Patent number	US10,856,408
Filing number	16/502,125
Publication status	Accepted/In press/Filed - 3 Jul 2019 Published - 1 Dec 2020

Link(s)

	Check@CityULib
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(ed369407-76bb-4e4f-a7a6-b086c95a5ad7).html

Citation Format(s)

[ RIS ] [ BibTeX ]

Substrate-Integrated Device And Method for Making The Same. / LEUNG, Kwok Wa (Inventor); LEE, Wai Ki (Inventor); KREMER, Hauke Ingolf (Inventor).
Patent No.: US10,856,408. Dec 01, 2020.

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

LEUNG, KW, LEE, WK & KREMER, HI Dec. 01 2020, Substrate-Integrated Device And Method for Making The Same, Patent No. US10,856,408.

LEUNG, K. W., LEE, W. K., & KREMER, H. I. (2020). Substrate-Integrated Device And Method for Making The Same. (Patent No. US10,856,408).

LEUNG KW, LEE WK, KREMER HI, inventors. Substrate-Integrated Device And Method for Making The Same. US10,856,408. 2020 Dec 1.

LEUNG, Kwok Wa (Inventor) ; LEE, Wai Ki (Inventor) ; KREMER, Hauke Ingolf (Inventor). / Substrate-Integrated Device And Method for Making The Same. Patent No.: US10,856,408. Dec 01, 2020.