Substrate-Integrated Device And Method for Making The Same

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53) › 51_Patents granted (CityU only, data source from KTO)

Overview

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Author(s)

Wai Ki LEE (Inventor)
Kwok Wa LEUNG (Inventor)
Hauke Ingolf KREMER (Inventor)

Related Research Unit(s)

Department of Electrical Engineering

Detail(s)

Original language	English
Patent number	US10,856,408
Filing number	16/502,125
Publication status	Accepted/In press/Filed - 3 Jul 2019 Published - 1 Dec 2020

Link(s)

	Check@CityULib
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(ed369407-76bb-4e4f-a7a6-b086c95a5ad7).html

Citation Format(s)

[ RIS ] [ BibTeX ]

Substrate-Integrated Device And Method for Making The Same. / LEE, Wai Ki (Inventor); LEUNG, Kwok Wa (Inventor); KREMER, Hauke Ingolf (Inventor).

Patent No.: US10,856,408. Dec 01, 2020.

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53) › 51_Patents granted (CityU only, data source from KTO)

LEE, WK, LEUNG, KW & KREMER, HI Dec. 01 2020, Substrate-Integrated Device And Method for Making The Same, Patent No. US10,856,408.

LEE, W. K., LEUNG, K. W., & KREMER, H. I. (2020). Substrate-Integrated Device And Method for Making The Same. (Patent No. US10,856,408).

LEE WK, LEUNG KW , KREMER HI, inventors. Substrate-Integrated Device And Method for Making The Same. US10,856,408. 2020 Dec 1.

LEE, Wai Ki (Inventor) ; LEUNG, Kwok Wa (Inventor) ; KREMER, Hauke Ingolf (Inventor). / Substrate-Integrated Device And Method for Making The Same. Patent No.: US10,856,408. Dec 01, 2020.