Abstract
This paper aims to investigate the primary cause for marked drops in quality factor (by over 98%) of a bulk mode resonator as a result of introducing etch holes into the structure. We show that thermoelastic damping (TED) appears to be the dominant cause of energy dissipation. The resonator is fabricated in single-crystal silicon (SCS). According to finite-element (FE) analysis, the uniform isochoric property of the Lamé mode is no longer preserved when etch holes are introduced. This results in marked drop in quality factor (Q) by 98.5% for the Lamé mode and 75.7% for the extensional from measurements. FE analysis based on coupled thermoelastic equations is used to compute the the thermal gradients that give rise to TED when etch holes are added to the resonator.
| Original language | English |
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| Title of host publication | 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 |
| Pages | 478-482 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 2012 |
| Event | 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan Duration: 5 Mar 2012 → 8 Mar 2012 |
Conference
| Conference | 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 |
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| Place | Japan |
| City | Kyoto |
| Period | 5/03/12 → 8/03/12 |
Research Keywords
- Etch holes
- Lamé mode resonator
- quality factor drop
- thermoelastic dissipation