TY - GEN
T1 - Study on the fabrication process and reliability performance of contactless smart card using nonconductive film
AU - Ma, Y.
AU - Chan, Y. C.
PY - 2005
Y1 - 2005
N2 - Contactless smart cards are widely used in various applications, such as access control, transit fare payment systems, etc. In order to improve the performance and at the same time to reduce the production cost, research work on the application of new materials and the development of new processes never stops. In this study, the assembly process of contactless smart card using nonconductive adhesive film (NCF) was investigated and adjusted considering the poor performance of PET substrate used in the test in terms of its heat resistance. Pressure cooker test was then performed to further evaluate reliability performances of the card assemblies after being subjected to severe temperature and humidity conditions. The smart card assemblies underwent both mechanical and electrical characterizations during the assembly process and the reliability test. Examinations on surface morphologies and cross-sections by SEM and optical microscope were conducted to understand the failure mechanisms. © 2005 IEEE.
AB - Contactless smart cards are widely used in various applications, such as access control, transit fare payment systems, etc. In order to improve the performance and at the same time to reduce the production cost, research work on the application of new materials and the development of new processes never stops. In this study, the assembly process of contactless smart card using nonconductive adhesive film (NCF) was investigated and adjusted considering the poor performance of PET substrate used in the test in terms of its heat resistance. Pressure cooker test was then performed to further evaluate reliability performances of the card assemblies after being subjected to severe temperature and humidity conditions. The smart card assemblies underwent both mechanical and electrical characterizations during the assembly process and the reliability test. Examinations on surface morphologies and cross-sections by SEM and optical microscope were conducted to understand the failure mechanisms. © 2005 IEEE.
KW - COF
KW - Contactless smart card
KW - NCF
UR - http://www.scopus.com/inward/record.url?scp=33847228025&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-33847228025&origin=recordpage
U2 - 10.1109/POLYTR.2005.1596496
DO - 10.1109/POLYTR.2005.1596496
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 0780395530
SN - 9780780395534
VL - 2005
SP - 102
EP - 107
BT - Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Proceedings
T2 - Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
Y2 - 23 October 2005 through 26 October 2005
ER -