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Study of the tensile strength of nanostructured copper obtained by electrodeposition and smat

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Overview

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Material Science

Copper Material Science

Ultimate Tensile St... Material Science

Electrodeposition Material Science

Materials Material Science

Ductility Material Science

Grain Size Material Science

Yield Stress Material Science

Surface (Surface Sc... Material Science

Nanostructured Mate... Material Science

Keyphrases

Tensile Strength Keyphrases

Electrodeposition Keyphrases

Nanoporous Copper Keyphrases

Surface Mechanical ... Keyphrases

Ductility Keyphrases

Yield Strength Keyphrases

Grain Size Keyphrases

Nanostructured Mate... Keyphrases

Nanostructures Keyphrases

Engineering Applica... Keyphrases

Electrodeposit Keyphrases

Electrodeposited Co... Keyphrases

Strong Materials Keyphrases

INIS

nanostructures INIS

tensile strength INIS

electrodeposition INIS

comparative evaluat... INIS

increasing INIS

yield strength INIS

engineering INIS

applications INIS

grain size INIS

Chemical Engineering

Copper Chemical Engineering

Electrodeposition Chemical Engineering

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