TY - JOUR
T1 - Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects
AU - Chiu, Y. W.
AU - Chan, Y. C.
AU - Lui, S. M.
PY - 2002/12
Y1 - 2002/12
N2 - Anisotropic conductive adhesive film (ACF) has been extensively used in the liquid crystal display (LCD) industry for decades on chip-on-glass (COG) applications. It offers the advantages in terms of fine-pitch capability and more environment compatibility. One of the very important performance requirements of using ACF in fine pitch interconnection is not to create leakage of electric current between adjacent joints as it may lead to abnormal display segments/pixels of the LCD. In this work, the possibility of short-circuiting between adjacent joints in fine pitch ACF interconnections under the effects of electric field was investigated. Insulation resistance measurements of the selected adjacent joints against electric field strength 1 V/μm for a 24 h testing duration were discussed and analyzed. The results showed a strong dependence of curing degree of the ACFs on the chance of short-circuiting between adjacent joints under field effects. © 2002 Elsevier Science Ltd. All rights reserved.
AB - Anisotropic conductive adhesive film (ACF) has been extensively used in the liquid crystal display (LCD) industry for decades on chip-on-glass (COG) applications. It offers the advantages in terms of fine-pitch capability and more environment compatibility. One of the very important performance requirements of using ACF in fine pitch interconnection is not to create leakage of electric current between adjacent joints as it may lead to abnormal display segments/pixels of the LCD. In this work, the possibility of short-circuiting between adjacent joints in fine pitch ACF interconnections under the effects of electric field was investigated. Insulation resistance measurements of the selected adjacent joints against electric field strength 1 V/μm for a 24 h testing duration were discussed and analyzed. The results showed a strong dependence of curing degree of the ACFs on the chance of short-circuiting between adjacent joints under field effects. © 2002 Elsevier Science Ltd. All rights reserved.
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U2 - 10.1016/S0026-2714(02)00097-5
DO - 10.1016/S0026-2714(02)00097-5
M3 - RGC 21 - Publication in refereed journal
SN - 0026-2714
VL - 42
SP - 1945
EP - 1951
JO - Microelectronics Reliability
JF - Microelectronics Reliability
IS - 12
ER -