Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

30 Scopus Citations
View graph of relations

Author(s)

Related Research Unit(s)

Detail(s)

Original languageEnglish
Pages (from-to)1755-1757
Journal / PublicationJournal of Materials Science Letters
Volume19
Issue number19
Publication statusPublished - Oct 2000

Abstract

The results of nickel phosphate growth due to a solder reaction-assisted crystallization of electroless Ni-P metallization are presented. It is observed that the ceasing of the growth may be due to losses of phosphorous during soldering and the observation of Kirkendall void has confirmed that the loss of phosphorous is due to the diffusion of phosphorous through channels and grain boundaries into solder.