Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization

K. C. Hung; Y. C. Chan

doi:10.1023/A:1006735103744

Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization

K. C. Hung, Y. C. Chan

Department of Electrical Engineering

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

31 Citations (Scopus)

Abstract

The results of nickel phosphate growth due to a solder reaction-assisted crystallization of electroless Ni-P metallization are presented. It is observed that the ceasing of the growth may be due to losses of phosphorous during soldering and the observation of Kirkendall void has confirmed that the loss of phosphorous is due to the diffusion of phosphorous through channels and grain boundaries into solder.

Original language	English
Pages (from-to)	1755-1757
Journal	Journal of Materials Science Letters
Volume	19
Issue number	19
DOIs	https://doi.org/10.1023/A:1006735103744
Publication status	Published - Oct 2000

Access Output

10.1023/A:1006735103744

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@article{e1394224ff504d5f94ccddcb34883bc8,

title = "Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization",

abstract = "The results of nickel phosphate growth due to a solder reaction-assisted crystallization of electroless Ni-P metallization are presented. It is observed that the ceasing of the growth may be due to losses of phosphorous during soldering and the observation of Kirkendall void has confirmed that the loss of phosphorous is due to the diffusion of phosphorous through channels and grain boundaries into solder.",

author = "Hung, {K. C.} and Chan, {Y. C.}",

year = "2000",

month = oct,

doi = "10.1023/A:1006735103744",

language = "English",

volume = "19",

pages = "1755--1757",

journal = "Journal of Materials Science Letters",

issn = "0261-8028",

publisher = "Chapman & Hall",

number = "19",

}

TY - JOUR

T1 - Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization

AU - Hung, K. C.

AU - Chan, Y. C.

PY - 2000/10

Y1 - 2000/10

N2 - The results of nickel phosphate growth due to a solder reaction-assisted crystallization of electroless Ni-P metallization are presented. It is observed that the ceasing of the growth may be due to losses of phosphorous during soldering and the observation of Kirkendall void has confirmed that the loss of phosphorous is due to the diffusion of phosphorous through channels and grain boundaries into solder.

AB - The results of nickel phosphate growth due to a solder reaction-assisted crystallization of electroless Ni-P metallization are presented. It is observed that the ceasing of the growth may be due to losses of phosphorous during soldering and the observation of Kirkendall void has confirmed that the loss of phosphorous is due to the diffusion of phosphorous through channels and grain boundaries into solder.

UR - http://www.scopus.com/inward/record.url?scp=0034300165&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0034300165&origin=recordpage

U2 - 10.1023/A:1006735103744

DO - 10.1023/A:1006735103744

M3 - RGC 21 - Publication in refereed journal

SN - 0261-8028

VL - 19

SP - 1755

EP - 1757

JO - Journal of Materials Science Letters

JF - Journal of Materials Science Letters

IS - 19

ER -

Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization

Abstract

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this