Studies of electrical characteristics of wire bonder transducer by clamp condition and on/off of bonding tool

Ming'an Guang; Han Lei; Hanxiong Li

doi:10.1109/HDP.2006.1707570

Studies of electrical characteristics of wire bonder transducer by clamp condition and on/off of bonding tool

Ming'an Guang^*, Han Lei, Hanxiong Li

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

1 Citation (Scopus)

Abstract

Dynamical characteristics of transducer are important for ultrasonic bonding quality. The admittance curves of transducer were studied, by tool on/off test and clamping tightness changing test. The model of equivalent circuit is used for parameter analysis, based on admittance circle of the transducer. The results show that additive mass of bonding tool and clamp tightness may not affect resonance frequency of a PZT transducer so much, but bonding tool is one of main factors affecting performance, because it changes the distribution and dissipation of energy in the PZT transducer. These results will be helpful for optimization of the ultrasonic bonding transducer. © 2006 IEEE.

Original language	English
Title of host publication	2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06
Publisher	IEEE
Pages	82-86
ISBN (Print)	9781424404889
DOIs	https://doi.org/10.1109/HDP.2006.1707570
Publication status	Published - 2006
Externally published	Yes
Event	2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'06) - Shanghai, China Duration: 27 Jun 2006 → 28 Jun 2006

Conference

Conference	2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'06)
Place	China
City	Shanghai
Period	27/06/06 → 28/06/06

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@inproceedings{2000cde35ed748bea1f6a4948d21511d,

title = "Studies of electrical characteristics of wire bonder transducer by clamp condition and on/off of bonding tool",

abstract = "Dynamical characteristics of transducer are important for ultrasonic bonding quality. The admittance curves of transducer were studied, by tool on/off test and clamping tightness changing test. The model of equivalent circuit is used for parameter analysis, based on admittance circle of the transducer. The results show that additive mass of bonding tool and clamp tightness may not affect resonance frequency of a PZT transducer so much, but bonding tool is one of main factors affecting performance, because it changes the distribution and dissipation of energy in the PZT transducer. These results will be helpful for optimization of the ultrasonic bonding transducer. {\textcopyright} 2006 IEEE.",

author = "Ming'an Guang and Han Lei and Hanxiong Li",

year = "2006",

doi = "10.1109/HDP.2006.1707570",

language = "English",

isbn = "9781424404889",

pages = "82--86",

booktitle = "2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06",

publisher = "IEEE",

address = "United States",

note = "2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'06) ; Conference date: 27-06-2006 Through 28-06-2006",

}

Guang, M, Lei, H & Li, H 2006, Studies of electrical characteristics of wire bonder transducer by clamp condition and on/off of bonding tool. in 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. IEEE, pp. 82-86, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'06), Shanghai, China, 27/06/06. https://doi.org/10.1109/HDP.2006.1707570

Studies of electrical characteristics of wire bonder transducer by clamp condition and on/off of bonding tool. / Guang, Ming'an; Lei, Han; Li, Hanxiong.
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. IEEE, 2006. p. 82-86.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Studies of electrical characteristics of wire bonder transducer by clamp condition and on/off of bonding tool

AU - Guang, Ming'an

AU - Lei, Han

AU - Li, Hanxiong

PY - 2006

Y1 - 2006

N2 - Dynamical characteristics of transducer are important for ultrasonic bonding quality. The admittance curves of transducer were studied, by tool on/off test and clamping tightness changing test. The model of equivalent circuit is used for parameter analysis, based on admittance circle of the transducer. The results show that additive mass of bonding tool and clamp tightness may not affect resonance frequency of a PZT transducer so much, but bonding tool is one of main factors affecting performance, because it changes the distribution and dissipation of energy in the PZT transducer. These results will be helpful for optimization of the ultrasonic bonding transducer. © 2006 IEEE.

AB - Dynamical characteristics of transducer are important for ultrasonic bonding quality. The admittance curves of transducer were studied, by tool on/off test and clamping tightness changing test. The model of equivalent circuit is used for parameter analysis, based on admittance circle of the transducer. The results show that additive mass of bonding tool and clamp tightness may not affect resonance frequency of a PZT transducer so much, but bonding tool is one of main factors affecting performance, because it changes the distribution and dissipation of energy in the PZT transducer. These results will be helpful for optimization of the ultrasonic bonding transducer. © 2006 IEEE.

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U2 - 10.1109/HDP.2006.1707570

DO - 10.1109/HDP.2006.1707570

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781424404889

SP - 82

EP - 86

BT - 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06

PB - IEEE

T2 - 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'06)

Y2 - 27 June 2006 through 28 June 2006

ER -

Studies of electrical characteristics of wire bonder transducer by clamp condition and on/off of bonding tool

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