Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang; K.N. Tu

doi:10.1016/j.mser.2014.06.001

Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang
, K.N. Tu^*

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

331 Citations (Scopus)

Abstract

Composite lead-free solders, containing micro and nano particles, have been widely studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder microstructure from coarsening in services, especially for Cu₆Sn₅, Ag₃Sn intermetallic compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the mechanical properties of the composite solder alloys were enhanced significantly. Moreover, these particles can influence the rate of interfacial reactions, and some particles can transform into a layer of intermetallic compound. Wettability, creep resistance, and hardness properties were affected by these particles. A systematic review of the development of these lead-free composite solders is given here, which hopefully may find applications in microbumps to be used in the future 3D IC technology.

Original language	English
Pages (from-to)	1-32
Journal	Materials Science and Engineering R: Reports
Volume	82
DOIs	https://doi.org/10.1016/j.mser.2014.06.001
Publication status	Published - Aug 2014
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

Creep
Intermetallic compounds
Lead-free solders
Nano-particles

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title = "Structure and properties of lead-free solders bearing micro and nano particles",

abstract = "Composite lead-free solders, containing micro and nano particles, have been widely studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder microstructure from coarsening in services, especially for Cu6Sn5, Ag3Sn intermetallic compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the mechanical properties of the composite solder alloys were enhanced significantly. Moreover, these particles can influence the rate of interfacial reactions, and some particles can transform into a layer of intermetallic compound. Wettability, creep resistance, and hardness properties were affected by these particles. A systematic review of the development of these lead-free composite solders is given here, which hopefully may find applications in microbumps to be used in the future 3D IC technology.",

keywords = "Creep, Intermetallic compounds, Lead-free solders, Nano-particles",

author = "Liang Zhang and K.N. Tu",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

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doi = "10.1016/j.mser.2014.06.001",

language = "English",

volume = "82",

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T1 - Structure and properties of lead-free solders bearing micro and nano particles

AU - Zhang, Liang

AU - Tu, K.N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2014/8

Y1 - 2014/8

N2 - Composite lead-free solders, containing micro and nano particles, have been widely studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder microstructure from coarsening in services, especially for Cu6Sn5, Ag3Sn intermetallic compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the mechanical properties of the composite solder alloys were enhanced significantly. Moreover, these particles can influence the rate of interfacial reactions, and some particles can transform into a layer of intermetallic compound. Wettability, creep resistance, and hardness properties were affected by these particles. A systematic review of the development of these lead-free composite solders is given here, which hopefully may find applications in microbumps to be used in the future 3D IC technology.

AB - Composite lead-free solders, containing micro and nano particles, have been widely studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder microstructure from coarsening in services, especially for Cu6Sn5, Ag3Sn intermetallic compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the mechanical properties of the composite solder alloys were enhanced significantly. Moreover, these particles can influence the rate of interfacial reactions, and some particles can transform into a layer of intermetallic compound. Wettability, creep resistance, and hardness properties were affected by these particles. A systematic review of the development of these lead-free composite solders is given here, which hopefully may find applications in microbumps to be used in the future 3D IC technology.

KW - Creep

KW - Intermetallic compounds

KW - Lead-free solders

KW - Nano-particles

UR - https://www.scopus.com/pages/publications/84903635425

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84903635425&origin=recordpage

U2 - 10.1016/j.mser.2014.06.001

DO - 10.1016/j.mser.2014.06.001

M3 - RGC 21 - Publication in refereed journal

SN - 0927-796X

VL - 82

SP - 1

EP - 32

JO - Materials Science and Engineering R: Reports

JF - Materials Science and Engineering R: Reports

ER -

Structure and properties of lead-free solders bearing micro and nano particles

Abstract

Bibliographical note

Research Keywords

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