Stresses in idealized triangular shaped surface mounted solder joints

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)22_Publication in policy or professional journalNot applicable

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Original languageEnglish
Journal / PublicationAmerican Society of Mechanical Engineers (Paper)
Publication statusPublished - 1995

Conference

TitleProceedings of the 1995 ASME International Mechanical Engineering Congress & Exposition
CitySan Francisco, CA, USA
Period12 - 17 November 1995

Abstract

In this paper, stresses of solder joints during power on were studied by a new laser interferometric method. By this method, deformations of both triangular shaped joints and 1206 chip resistors were measured in three different home made specimens. From the measured deformations, the stress history of the joints was found to be different from tests other than power cycling. The average stresses in the joints were also compared among the three specimens. In addition, the deformations of the specimens at steady state were modeled by a nonlinear finite element analysis program. Comparison was made between the modeled results and the measured results, which were found to agree qualitatively.