Strengthening and toughening by interface-mediated slip transfer reaction in nanotwinned copper
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 508-511 |
Journal / Publication | Scripta Materialia |
Volume | 60 |
Issue number | 7 |
Publication status | Published - Apr 2009 |
Externally published | Yes |
Link(s)
Abstract
Molecular dynamics simulation of tensile deformation shows that the high strength of nanotwinned copper is initially the result of the twin boundary pinning effect on dislocation motion, and that interface-mediated slip transfer mechanisms operate in the later stages of deformation. These mechanisms include the complete transmission of screw dislocations across twin boundaries via Fleischer and Friedel-Escaig mechanisms, the incomplete transmission of non-screw dislocations and transmission-induced jog formation. These factors are effective at maintaining the material's high strength and good ductility. © 2008 Acta Materialia Inc.
Research Area(s)
- Ductility, Molecular dynamics simulations, Nanotwinned copper, Plastic deformation, Strength
Citation Format(s)
Strengthening and toughening by interface-mediated slip transfer reaction in nanotwinned copper. / Zheng, Y. G.; Lu, J.; Zhang, H. W. et al.
In: Scripta Materialia, Vol. 60, No. 7, 04.2009, p. 508-511.
In: Scripta Materialia, Vol. 60, No. 7, 04.2009, p. 508-511.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review