Strengthening and toughening by interface-mediated slip transfer reaction in nanotwinned copper

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

  • Y. G. Zheng
  • J. Lu
  • H. W. Zhang
  • Z. Chen

Detail(s)

Original languageEnglish
Pages (from-to)508-511
Journal / PublicationScripta Materialia
Volume60
Issue number7
Publication statusPublished - Apr 2009
Externally publishedYes

Abstract

Molecular dynamics simulation of tensile deformation shows that the high strength of nanotwinned copper is initially the result of the twin boundary pinning effect on dislocation motion, and that interface-mediated slip transfer mechanisms operate in the later stages of deformation. These mechanisms include the complete transmission of screw dislocations across twin boundaries via Fleischer and Friedel-Escaig mechanisms, the incomplete transmission of non-screw dislocations and transmission-induced jog formation. These factors are effective at maintaining the material's high strength and good ductility. © 2008 Acta Materialia Inc.

Research Area(s)

  • Ductility, Molecular dynamics simulations, Nanotwinned copper, Plastic deformation, Strength

Citation Format(s)

Strengthening and toughening by interface-mediated slip transfer reaction in nanotwinned copper. / Zheng, Y. G.; Lu, J.; Zhang, H. W. et al.
In: Scripta Materialia, Vol. 60, No. 7, 04.2009, p. 508-511.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review