Strategies for Optimizing Electroplated Copper Microstructure and Prolonging Queue Time in Cu-Cu Bonding Applications

Yonghan ZHOU; Kaiyu MU; Gangqiang PENG; Chuan HE; Zejia ZHAO; Jinyang LI; Hung-Fei KUO; Shien-Ping FENG

doi:10.1109/EDTM65772.2026.11497975

Strategies for Optimizing Electroplated Copper Microstructure and Prolonging Queue Time in Cu-Cu Bonding Applications

Yonghan ZHOU
, Kaiyu MU
, Gangqiang PENG
, Chuan HE
, Zejia ZHAO
, Jinyang LI
, Hung-Fei KUO
, Shien-Ping FENG

Department of Systems Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

Direct Cu-Cu bonding enables high-density 3D packaging with superior performance and low power consumption but faces a trade-off between bonding temperature and microstructural stability. Coarse-grained Cu requires high temperature (>300 °C), while nanograined Cu coarsens rapidly after plating. This study explores extending queue time and lowering bonding temperature through storage at low temperature, impurity incorporation, and hybrid structures. A stable and reliable Cu material for manufacturing is essential for next-generation heterogeneous 3D-IC integration. ©2026 IEEE.

Original language	English
Title of host publication	2026 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
Place of Publication	United States
Publisher	IEEE
ISBN (Electronic)	979-8-3315-8598-3
ISBN (Print)	979-8-3315-8599-0
DOIs	https://doi.org/10.1109/EDTM65772.2026.11497975
Publication status	Published - 1 Mar 2026
Event	10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) - Penang, Malaysia Duration: 1 Mar 2026 → 4 Mar 2026 https://ieeexplore.ieee.org/xpl/conhome/11496632/proceeding

Conference

Conference	10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
Abbreviated title	EDTM 2026
Place	Malaysia
City	Penang
Period	1/03/26 → 4/03/26
Internet address	https://ieeexplore.ieee.org/xpl/conhome/11496632/proceeding

Funding

We thank for the support from the TRS Grant (T46-705/23-R) from the Research Grants Council of Hong Kong. The authors thank Doctech HK Ltd. for the material and technical support.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Research Keywords

low temperature
impurity
hybrid structure

RGC Funding Information

RGC-funded

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10.1109/EDTM65772.2026.11497975

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@inproceedings{7be2677525304c8b965d2fab4fc768fa,

title = "Strategies for Optimizing Electroplated Copper Microstructure and Prolonging Queue Time in Cu-Cu Bonding Applications",

abstract = "Direct Cu-Cu bonding enables high-density 3D packaging with superior performance and low power consumption but faces a trade-off between bonding temperature and microstructural stability. Coarse-grained Cu requires high temperature (>300 °C), while nanograined Cu coarsens rapidly after plating. This study explores extending queue time and lowering bonding temperature through storage at low temperature, impurity incorporation, and hybrid structures. A stable and reliable Cu material for manufacturing is essential for next-generation heterogeneous 3D-IC integration. {\textcopyright}2026 IEEE.",

keywords = "low temperature, impurity, hybrid structure",

author = "Yonghan ZHOU and Kaiyu MU and Gangqiang PENG and Chuan HE and Zejia ZHAO and Jinyang LI and Hung-Fei KUO and Shien-Ping FENG",

year = "2026",

month = mar,

day = "1",

doi = "10.1109/EDTM65772.2026.11497975",

language = "English",

isbn = "979-8-3315-8599-0",

booktitle = "2026 10th IEEE Electron Devices Technology \& Manufacturing Conference (EDTM)",

publisher = "IEEE",

address = "United States",

note = "10th IEEE Electron Devices Technology \& Manufacturing Conference (EDTM), EDTM 2026 ; Conference date: 01-03-2026 Through 04-03-2026",

url = "https://ieeexplore.ieee.org/xpl/conhome/11496632/proceeding",

}

ZHOU, Y, MU, K, PENG, G , HE, C, ZHAO, Z, LI, J, KUO, H-F & FENG, S-P 2026, Strategies for Optimizing Electroplated Copper Microstructure and Prolonging Queue Time in Cu-Cu Bonding Applications. in 2026 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). IEEE, United States, 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Penang, Malaysia, 1/03/26. https://doi.org/10.1109/EDTM65772.2026.11497975

Strategies for Optimizing Electroplated Copper Microstructure and Prolonging Queue Time in Cu-Cu Bonding Applications. / ZHOU, Yonghan; MU, Kaiyu; PENG, Gangqiang et al.
2026 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). United States: IEEE, 2026.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Strategies for Optimizing Electroplated Copper Microstructure and Prolonging Queue Time in Cu-Cu Bonding Applications

AU - ZHOU, Yonghan

AU - MU, Kaiyu

AU - PENG, Gangqiang

AU - HE, Chuan

AU - ZHAO, Zejia

AU - LI, Jinyang

AU - KUO, Hung-Fei

AU - FENG, Shien-Ping

PY - 2026/3/1

Y1 - 2026/3/1

N2 - Direct Cu-Cu bonding enables high-density 3D packaging with superior performance and low power consumption but faces a trade-off between bonding temperature and microstructural stability. Coarse-grained Cu requires high temperature (>300 °C), while nanograined Cu coarsens rapidly after plating. This study explores extending queue time and lowering bonding temperature through storage at low temperature, impurity incorporation, and hybrid structures. A stable and reliable Cu material for manufacturing is essential for next-generation heterogeneous 3D-IC integration. ©2026 IEEE.

AB - Direct Cu-Cu bonding enables high-density 3D packaging with superior performance and low power consumption but faces a trade-off between bonding temperature and microstructural stability. Coarse-grained Cu requires high temperature (>300 °C), while nanograined Cu coarsens rapidly after plating. This study explores extending queue time and lowering bonding temperature through storage at low temperature, impurity incorporation, and hybrid structures. A stable and reliable Cu material for manufacturing is essential for next-generation heterogeneous 3D-IC integration. ©2026 IEEE.

KW - low temperature

KW - impurity

KW - hybrid structure

UR - https://www.scopus.com/pages/publications/105040815174

UR - https://www.scopus.com/pages/publications/105040815174#tab=impact

U2 - 10.1109/EDTM65772.2026.11497975

DO - 10.1109/EDTM65772.2026.11497975

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 979-8-3315-8599-0

BT - 2026 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

PB - IEEE

CY - United States

T2 - 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

Y2 - 1 March 2026 through 4 March 2026

ER -

Strategies for Optimizing Electroplated Copper Microstructure and Prolonging Queue Time in Cu-Cu Bonding Applications

Abstract

Conference

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UN SDGs

Research Keywords

RGC Funding Information

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