Strain rate measurement by Electronic Speckle Pattern Interferometry : A new look at the strain localization onset

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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Author(s)

  • Bruno Guelorget
  • Manuel François
  • Cristián Vial-Edwards
  • Guillaume Montay
  • Laurent Daniel

Detail(s)

Original languageEnglish
Pages (from-to)234-241
Journal / PublicationMaterials Science and Engineering A
Volume415
Issue number1-2
Publication statusPublished - 15 Jan 2006
Externally publishedYes

Abstract

In-plane Electronic Speckle Pattern Interferometry has been successfully used during tensile testing of semi-hard copper sheets in order to measure the strain rate. On one hand, heterogeneity in strain rate field has been found before the maximum of the tensile force (εt ≃ 19.4 and 25.4%, respectively). Thus, a localization phenomenon occurs before the classic Considère's criterion (dF = 0) for the diffuse neck initiation. On the other hand, strain rate measurement before fracture shows the moment where one of the two slip band systems becomes predominant, then strain concentrates in a small area, the shear band. Uncertainty evaluation has been carried out, which shows a very good accuracy of the total strain and the strain rate measurements. © 2005 Elsevier B.V. All rights reserved.

Research Area(s)

  • ESPI, Necking, Strain localization, Strain rate measurement, Tensile test, Uncertainty determination

Citation Format(s)

Strain rate measurement by Electronic Speckle Pattern Interferometry : A new look at the strain localization onset. / Guelorget, Bruno; François, Manuel; Vial-Edwards, Cristián; Montay, Guillaume; Daniel, Laurent; Lu, Jian.

In: Materials Science and Engineering A, Vol. 415, No. 1-2, 15.01.2006, p. 234-241.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal