Strain rate measurement by Electronic Speckle Pattern Interferometry: A new look at the strain localization onset

Bruno Guelorget; Manuel François; Cristián Vial-Edwards; Guillaume Montay; Laurent Daniel; Jian Lu

doi:10.1016/j.msea.2005.09.090

Author(s)

Bruno Guelorget
Manuel François
Cristián Vial-Edwards
Guillaume Montay
Laurent Daniel

Detail(s)

Original language	English
Pages (from-to)	234-241
Journal / Publication	Materials Science and Engineering A
Volume	415
Issue number	1-2
Publication status	Published - 15 Jan 2006
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1016/j.msea.2005.09.090 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-29244476049&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(6492d14d-6948-446f-932a-6e41bbd044f8).html

Abstract

In-plane Electronic Speckle Pattern Interferometry has been successfully used during tensile testing of semi-hard copper sheets in order to measure the strain rate. On one hand, heterogeneity in strain rate field has been found before the maximum of the tensile force (ε^t ≃ 19.4 and 25.4%, respectively). Thus, a localization phenomenon occurs before the classic Considère's criterion (dF = 0) for the diffuse neck initiation. On the other hand, strain rate measurement before fracture shows the moment where one of the two slip band systems becomes predominant, then strain concentrates in a small area, the shear band. Uncertainty evaluation has been carried out, which shows a very good accuracy of the total strain and the strain rate measurements. © 2005 Elsevier B.V. All rights reserved.

Research Area(s)

ESPI, Necking, Strain localization, Strain rate measurement, Tensile test, Uncertainty determination

Citation Format(s)

[ RIS ] [ BibTeX ]

Strain rate measurement by Electronic Speckle Pattern Interferometry : A new look at the strain localization onset. / Guelorget, Bruno; François, Manuel; Vial-Edwards, Cristián et al.

In: Materials Science and Engineering A, Vol. 415, No. 1-2, 15.01.2006, p. 234-241.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

Guelorget, B, François, M, Vial-Edwards, C, Montay, G, Daniel, L & Lu, J 2006, 'Strain rate measurement by Electronic Speckle Pattern Interferometry: A new look at the strain localization onset', Materials Science and Engineering A, vol. 415, no. 1-2, pp. 234-241. https://doi.org/10.1016/j.msea.2005.09.090

Guelorget, B., François, M., Vial-Edwards, C., Montay, G., Daniel, L., & Lu, J. (2006). Strain rate measurement by Electronic Speckle Pattern Interferometry: A new look at the strain localization onset. Materials Science and Engineering A, 415(1-2), 234-241. https://doi.org/10.1016/j.msea.2005.09.090

Guelorget B, François M, Vial-Edwards C, Montay G, Daniel L, Lu J. Strain rate measurement by Electronic Speckle Pattern Interferometry: A new look at the strain localization onset. Materials Science and Engineering A. 2006 Jan 15;415(1-2):234-241. doi: 10.1016/j.msea.2005.09.090

Guelorget, Bruno ; François, Manuel ; Vial-Edwards, Cristián et al. / Strain rate measurement by Electronic Speckle Pattern Interferometry : A new look at the strain localization onset. In: Materials Science and Engineering A. 2006 ; Vol. 415, No. 1-2. pp. 234-241.

Strain rate measurement by Electronic Speckle Pattern Interferometry : A new look at the strain localization onset