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Strain engineering of microfabricated diamond and its applications

  • Wenjun Liang
  • , Limin Yang
  • , Jiaqi Zhu
  • , Yiling Lian
  • , Yang Lu*
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

99 Downloads (CityUHK Scholars)

Abstract

Diamond is considered the ultimate semiconductor material due to its excellent physical and electrical properties, such as ultrahigh thermal conductivity, ultrawide bandgap, and superhigh carrier mobility. After ultralarge deformation experimentally conducted on diamond in 2018 and 2021, strain engineering is a highly appealing candidate for tuning these properties of diamond, opening up potential applications in microelectronics and quantum technologies. In this review, we briefly review the implementation of strain engineering on diamond, including introducing dynamic strain by nanomechanical tests and maintaining static strain by various methods. We also provide a brief overview of the strain-induced property changes and the specific applications of the strained diamond. © 2025 Author(s).
Original languageEnglish
Article number060602
JournalAPL Materials
Volume13
Issue number6
Online published6 Jun 2025
DOIs
Publication statusPublished - Jun 2025

Funding

The authors acknowledge the financial support from the Research Grants Council of the Hong Kong Special Administrative Region, China under Grant Nos. RFS2021-1S05 and N_HKU159/22 and the Department of Science and Technology of Hunan Province under Grant No. 2023GK2013.

Publisher's Copyright Statement

  • This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/

RGC Funding Information

  • RGC-funded

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