Statistical models for hot electron degradation in nano-scaled MOSFET devices
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 392-400 |
Journal / Publication | IEEE Transactions on Reliability |
Volume | 56 |
Issue number | 3 |
Publication status | Published - Sept 2007 |
Externally published | Yes |
Link(s)
Abstract
In a MOS structure, the generation of hot carrier interface states is a critical feature of the item's reliability. On the nano-scale, there are problems with degradation in transconductance, shift in threshold voltage, and decrease in drain current capability. Quantum mechanics has been used to relate this decrease to degradation, and device failure. Although the lifetime, and degradation of a device are typically used to characterize its reliability, in this paper we model the distribution of hot-electron activation energies, which has appeal because it exhibits a two-point discrete mixture of logistic distributions. The logistic mixture presents computational problems that are addressed in simulation. © 2007 IEEE.
Research Area(s)
- EM algorithm, Logistic distribution, Maximum likelihood, Mixture distribution, Nanotechnology
Citation Format(s)
Statistical models for hot electron degradation in nano-scaled MOSFET devices. / Bae, Suk Bae; Kim, Seong-Joon; Kuo, Way et al.
In: IEEE Transactions on Reliability, Vol. 56, No. 3, 09.2007, p. 392-400.
In: IEEE Transactions on Reliability, Vol. 56, No. 3, 09.2007, p. 392-400.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review