TY - JOUR
T1 - Statistical models for hot electron degradation in nano-scaled MOSFET devices
AU - Bae, Suk Bae
AU - Kim, Seong-Joon
AU - Kuo, Way
AU - Kvam, Paul H.
PY - 2007/9
Y1 - 2007/9
N2 - In a MOS structure, the generation of hot carrier interface states is a critical feature of the item's reliability. On the nano-scale, there are problems with degradation in transconductance, shift in threshold voltage, and decrease in drain current capability. Quantum mechanics has been used to relate this decrease to degradation, and device failure. Although the lifetime, and degradation of a device are typically used to characterize its reliability, in this paper we model the distribution of hot-electron activation energies, which has appeal because it exhibits a two-point discrete mixture of logistic distributions. The logistic mixture presents computational problems that are addressed in simulation. © 2007 IEEE.
AB - In a MOS structure, the generation of hot carrier interface states is a critical feature of the item's reliability. On the nano-scale, there are problems with degradation in transconductance, shift in threshold voltage, and decrease in drain current capability. Quantum mechanics has been used to relate this decrease to degradation, and device failure. Although the lifetime, and degradation of a device are typically used to characterize its reliability, in this paper we model the distribution of hot-electron activation energies, which has appeal because it exhibits a two-point discrete mixture of logistic distributions. The logistic mixture presents computational problems that are addressed in simulation. © 2007 IEEE.
KW - EM algorithm
KW - Logistic distribution
KW - Maximum likelihood
KW - Mixture distribution
KW - Nanotechnology
UR - http://www.scopus.com/inward/record.url?scp=34548620827&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-34548620827&origin=recordpage
U2 - 10.1109/TR.2007.903232
DO - 10.1109/TR.2007.903232
M3 - RGC 21 - Publication in refereed journal
SN - 0018-9529
VL - 56
SP - 392
EP - 400
JO - IEEE Transactions on Reliability
JF - IEEE Transactions on Reliability
IS - 3
ER -