TY - JOUR
T1 - Standards for tin whisker test methods on lead-free components
AU - Shibutani, Tadahiro
AU - Osterman, Michael
AU - Pecht, Michael
PY - 2009
Y1 - 2009
N2 - Tin whiskers are widely recognized as being a reliability threat to lead-free electronic components. The current standards to assess the tin whisker susceptibility of lead-free finishes in electronic components are problematic. Key problems include lack of data collection, lack of agreement on proper techniques for measuring whisker length, lack of established acceleration transforms for prescribed tests, and disagreement over acceptance criteria. This paper overviews the tin whisker standards and then describes the problems listed above. Recommendations for improvements are then presented and discussed. © 2009 IEEE.
AB - Tin whiskers are widely recognized as being a reliability threat to lead-free electronic components. The current standards to assess the tin whisker susceptibility of lead-free finishes in electronic components are problematic. Key problems include lack of data collection, lack of agreement on proper techniques for measuring whisker length, lack of established acceleration transforms for prescribed tests, and disagreement over acceptance criteria. This paper overviews the tin whisker standards and then describes the problems listed above. Recommendations for improvements are then presented and discussed. © 2009 IEEE.
KW - Environmental test
KW - Lead-free electronics
KW - Standard
KW - Tin whisker
UR - http://www.scopus.com/inward/record.url?scp=63049139479&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-63049139479&origin=recordpage
U2 - 10.1109/TCAPT.2009.2013311
DO - 10.1109/TCAPT.2009.2013311
M3 - RGC 21 - Publication in refereed journal
SN - 1521-3331
VL - 32
SP - 216
EP - 219
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
IS - 1
ER -