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Stability scheme of ZnO-thin film resistive switching memory: Influence of defects by controllable oxygen pressure ratio

  • Hsin-Wei Huang
  • , Chen-Fang Kang
  • , Fang-I Lai
  • , Jr-Hau He
  • , Su-Jien Lin
  • , Yu-Lun Chueh*
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

13 Downloads (CityUHK Scholars)

Abstract

We report a stability scheme of resistive switching devices based on ZnO films deposited by radio frequency (RF) sputtering process at different oxygen pressure ratios. I-V measurements and statistical results indicate that the operating stability of ZnO resistive random access memory (ReRAM) devices is highly dependent on oxygen conditions. Data indicates that the ZnO film ReRAM device fabricated at 10% O2 pressure ratio exhibits the best performance. Transmission electron microscopy (TEM) and X-ray diffraction (XRD) of ZnO at different O2 pressure ratios were investigated to reflect influence of structure to the stable switching behaviors. In addition, PL and XPS results were measured to investigate the different charge states triggered in ZnO by oxygen vacancies, which affect the stability of the switching behavior.  
Original languageEnglish
Article number483
JournalNanoscale Research Letters
Volume8
Online published16 Nov 2013
DOIs
Publication statusPublished - 2013
Externally publishedYes

Research Keywords

  • O2 partial pressure
  • Oxygen defects
  • Resistive change memory
  • ZnO

Publisher's Copyright Statement

  • This full text is made available under CC-BY 2.0. https://creativecommons.org/licenses/by/2.0/

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