Stability of nanoscale twins in copper under electric current stressing

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

17 Scopus Citations
View graph of relations

Author(s)

  • Kuan-Chia Chen
  • Wen-Wei Wu
  • Chien-Neng Liao
  • Lih-Juann Chen
  • K. N. Tu

Detail(s)

Original languageEnglish
Article number066103
Journal / PublicationJournal of Applied Physics
Volume108
Issue number6
Publication statusPublished - 15 Sept 2010
Externally publishedYes

Abstract

Migration of {112} incoherent twin boundary (ITB) in nanotwinned Cu under electric current stressing has been observed using in situ high-resolution transmission electron microscopy. The current-driven ITB migration is found to be four orders of magnitude faster than that driven thermally. We propose that electric current plays a role of shuffling Cu atoms at ITB/coherent twin boundary junctions, which enhances nucleation of {112} steps and facilitates twin boundary migration in Cu. By understanding how twin boundaries respond to electric current force we shall be able to trace the property change in nanotwinned Cu under electric current stressing, which would be an essential assessment of interconnect reliability. © 2010 American Institute of Physics.

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to lbscholars@cityu.edu.hk.

Citation Format(s)

Stability of nanoscale twins in copper under electric current stressing. / Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng et al.
In: Journal of Applied Physics, Vol. 108, No. 6, 066103, 15.09.2010.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review