Spontaneous Tin Whisker Growth: Mechanism and Prevention

King-Ning Tu

doi:10.1007/978-0-387-38892-2_6

Spontaneous Tin Whisker Growth: Mechanism and Prevention

King-Ning Tu^*

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › Chapter in research book/monograph/textbook (Author) › peer-review

11 Citations (Scopus)

Abstract

Whisker growth on beta-tin (β-Sn) is a surface relief phenomenon of creep [1–16]. It is driven by a compressive stress gradient and occurs at room temperature. Spontaneous Sn whiskers are known to grow on matte Sn finish on Cu. Today, due to the wide application of Pb-free solders on Cu conductors used in the packaging of consumer electronic products, Sn whisker growth has become a serious reliability issue because the Sn-based Pb-free solders are very rich in Sn. The matrix of most Sn-based Pb-free solders is almost pure Sn. The well-known phenomena of tin such as tin-cry, tin-pest, and tin-whisker are receiving attention again. © 2007 Springer Science+Business Media, LLC

Original language	English
Title of host publication	Solder Joint Technology
Subtitle of host publication	Materials, Properties, and Reliability
Place of Publication	New York, NY
Publisher	Springer
Pages	153-181
ISBN (Electronic)	978-0-387-38892-2
ISBN (Print)	978-0-387-38890-8, 978-1-4419-2284-7
DOIs	https://doi.org/10.1007/978-0-387-38892-2_6
Publication status	Published - 2007
Externally published	Yes

Publication series

Name	Springer Series in Materials Science
Volume	117
ISSN (Print)	0933-033X
ISSN (Electronic)	2196-2812

Research Keywords

Consumer Electronic Product
Deviatoric Strain Tensor
Laue Pattern
Stress Gradient
Whisker Growth

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10.1007/978-0-387-38892-2_6

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Spontaneous Tin Whisker Growth: Mechanism and Prevention. / Tu, King-Ning.
Solder Joint Technology: Materials, Properties, and Reliability. New York, NY: Springer , 2007. p. 153-181 (Springer Series in Materials Science; Vol. 117).

Research output: Chapters, Conference Papers, Creative and Literary Works › Chapter in research book/monograph/textbook (Author) › peer-review

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T2 - Mechanism and Prevention

AU - Tu, King-Ning

PY - 2007

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N2 - Whisker growth on beta-tin (β-Sn) is a surface relief phenomenon of creep [1–16]. It is driven by a compressive stress gradient and occurs at room temperature. Spontaneous Sn whiskers are known to grow on matte Sn finish on Cu. Today, due to the wide application of Pb-free solders on Cu conductors used in the packaging of consumer electronic products, Sn whisker growth has become a serious reliability issue because the Sn-based Pb-free solders are very rich in Sn. The matrix of most Sn-based Pb-free solders is almost pure Sn. The well-known phenomena of tin such as tin-cry, tin-pest, and tin-whisker are receiving attention again. © 2007 Springer Science+Business Media, LLC

AB - Whisker growth on beta-tin (β-Sn) is a surface relief phenomenon of creep [1–16]. It is driven by a compressive stress gradient and occurs at room temperature. Spontaneous Sn whiskers are known to grow on matte Sn finish on Cu. Today, due to the wide application of Pb-free solders on Cu conductors used in the packaging of consumer electronic products, Sn whisker growth has become a serious reliability issue because the Sn-based Pb-free solders are very rich in Sn. The matrix of most Sn-based Pb-free solders is almost pure Sn. The well-known phenomena of tin such as tin-cry, tin-pest, and tin-whisker are receiving attention again. © 2007 Springer Science+Business Media, LLC

KW - Consumer Electronic Product

KW - Deviatoric Strain Tensor

KW - Laue Pattern

KW - Stress Gradient

KW - Whisker Growth

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SN - 978-1-4419-2284-7

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SP - 153

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BT - Solder Joint Technology

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Spontaneous Tin Whisker Growth: Mechanism and Prevention

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Research Keywords

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