Spalling of Cu-Sn compound spheroids in solder joints on Si wafers
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 27-30 |
| Journal / Publication | Materials Research Society Symposium - Proceedings |
| Volume | 445 |
| Publication status | Published - 1997 |
| Externally published | Yes |
Conference
| Title | Proceedings of the 1996 MRS Fall Symposium |
|---|---|
| City | Boston, MA, USA |
| Period | 3 - 5 December 1996 |
Link(s)
Abstract
In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface below the solder joint. It suggests that gravity plays a role.
Bibliographic Note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to lbscholars@cityu.edu.hk.
Citation Format(s)
Spalling of Cu-Sn compound spheroids in solder joints on Si wafers. / Kim, H. K.; Tu, K. N.
In: Materials Research Society Symposium - Proceedings, Vol. 445, 1997, p. 27-30.
In: Materials Research Society Symposium - Proceedings, Vol. 445, 1997, p. 27-30.
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
