Spalling of Cu-Sn compound spheroids in solder joints on Si wafers

H. K. Kim; K. N. Tu

doi:10.1557/proc-445-27

Spalling of Cu-Sn compound spheroids in solder joints on Si wafers

H. K. Kim
, K. N. Tu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Abstract

In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu₆Sn₅ spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface below the solder joint. It suggests that gravity plays a role.

Original language	English
Pages (from-to)	27-30
Journal	Materials Research Society Symposium - Proceedings
Volume	445
DOIs	https://doi.org/10.1557/proc-445-27
Publication status	Published - 1997
Externally published	Yes
Event	Proceedings of the 1996 MRS Fall Symposium - Boston, MA, USA Duration: 3 Dec 1996 → 5 Dec 1996

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Spalling of Cu-Sn compound spheroids in solder joints on Si wafers",

abstract = "In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface below the solder joint. It suggests that gravity plays a role.",

author = "Kim, \{H. K.\} and Tu, \{K. N.\}",

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doi = "10.1557/proc-445-27",

language = "English",

volume = "445",

pages = "27--30",

journal = "Materials Research Society Symposium - Proceedings",

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T1 - Spalling of Cu-Sn compound spheroids in solder joints on Si wafers

AU - Kim, H. K.

AU - Tu, K. N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 1997

Y1 - 1997

N2 - In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface below the solder joint. It suggests that gravity plays a role.

AB - In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface below the solder joint. It suggests that gravity plays a role.

UR - https://www.scopus.com/pages/publications/0031373603

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0031373603&origin=recordpage

U2 - 10.1557/proc-445-27

DO - 10.1557/proc-445-27

M3 - RGC 21 - Publication in refereed journal

SN - 0272-9172

VL - 445

SP - 27

EP - 30

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1996 MRS Fall Symposium

Y2 - 3 December 1996 through 5 December 1996

ER -

Spalling of Cu-Sn compound spheroids in solder joints on Si wafers

Abstract

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