Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

Zifeng Wang; Yuqiao Fu; Wenjun Meng; Chunyi Zhi

doi:10.1186/1556-276X-9-643

Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

Zifeng Wang, Yuqiao Fu, Wenjun Meng, Chunyi Zhi^*

^*Corresponding author for this work

CityUHK Shenzhen Research Institute

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

43 Citations (Scopus)

125 Downloads (CityUHK Scholars)

Abstract

A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved.

Original language	English
Article number	643
Journal	Nanoscale Research Letters
Volume	9
Online published	29 Nov 2014
DOIs	https://doi.org/10.1186/1556-276X-9-643
Publication status	Published - 2014

Research Keywords

Boron nitride nanoplatelets
Epoxy composites
Solvent-free fabrication
Thermal conductivity

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This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/

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10.1186/1556-276X-9-643

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@article{2db9315292d647f4a9bcafc4403b734a,

title = "Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers",

abstract = "A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved.",

keywords = "Boron nitride nanoplatelets, Epoxy composites, Solvent-free fabrication, Thermal conductivity",

author = "Zifeng Wang and Yuqiao Fu and Wenjun Meng and Chunyi Zhi",

year = "2014",

doi = "10.1186/1556-276X-9-643",

language = "English",

volume = "9",

journal = "Nanoscale Research Letters",

issn = "1931-7573",

publisher = "Springer New York",

}

TY - JOUR

T1 - Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

AU - Wang, Zifeng

AU - Fu, Yuqiao

AU - Meng, Wenjun

AU - Zhi, Chunyi

PY - 2014

Y1 - 2014

N2 - A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved.

AB - A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved.

KW - Boron nitride nanoplatelets

KW - Epoxy composites

KW - Solvent-free fabrication

KW - Thermal conductivity

UR - http://www.scopus.com/inward/record.url?scp=84916613093&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84916613093&origin=recordpage

U2 - 10.1186/1556-276X-9-643

DO - 10.1186/1556-276X-9-643

M3 - RGC 21 - Publication in refereed journal

C2 - 25489292

SN - 1931-7573

VL - 9

JO - Nanoscale Research Letters

JF - Nanoscale Research Letters

M1 - 643

ER -

Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

Abstract

Research Keywords

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ECS: Insulating Polymer Composites with Ultrahigh Thermal Conductivity by Synergetic Effects of Boron Nitride Nanostructures

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Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

Abstract

Research Keywords

Publisher's Copyright Statement

Access Output

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ECS: Insulating Polymer Composites with Ultrahigh Thermal Conductivity by Synergetic Effects of Boron Nitride Nanostructures

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