Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Student Theses
- 2019
New Product Development Strategies for High-reliability Flexible Electronics Packaging
PUN, P. L. (Author), CHAN, H. S. A. (Supervisor), 18 Jun 2019Student thesis: Doctoral Thesis