Solid-state diffusion bonding of tungsten-25 rhenium alloy

T. G. Nieh

doi:10.1007/BF01114275

Solid-state diffusion bonding of tungsten-25 rhenium alloy

T. G. Nieh

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

9 Citations (Scopus)

Abstract

Nickel has successfully been used as an interleaf material to join W-25Re between 900 and 1400° C. The bond strength was found to depend on the temperature and stress at which the bonding process was conducted. It was also found that nickel reacts with the parent metal and forms a Ni-W-Re ternary alloy. The formation of the alloy causes significant embrittlement in the parent material. The alloy first nucleates at the grain boundary and then grows into the grain. Quantitative studies of the growth kinetics of the ternary alloy and its effect on the bond strength are discussed. Joining of W-25Re by self-diffusion bonding has also been successfully demonstrated at temperatures above 1500° C. The effect of surface conditions will be correlated with the quality of the joint. © 1986 Chapman and Hall Ltd.

Original language	English
Pages (from-to)	2327-2334
Journal	Journal of Materials Science
Volume	21
Issue number	7
DOIs	https://doi.org/10.1007/BF01114275
Publication status	Published - Jul 1986
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Solid-state diffusion bonding of tungsten-25 rhenium alloy",

abstract = "Nickel has successfully been used as an interleaf material to join W-25Re between 900 and 1400° C. The bond strength was found to depend on the temperature and stress at which the bonding process was conducted. It was also found that nickel reacts with the parent metal and forms a Ni-W-Re ternary alloy. The formation of the alloy causes significant embrittlement in the parent material. The alloy first nucleates at the grain boundary and then grows into the grain. Quantitative studies of the growth kinetics of the ternary alloy and its effect on the bond strength are discussed. Joining of W-25Re by self-diffusion bonding has also been successfully demonstrated at temperatures above 1500° C. The effect of surface conditions will be correlated with the quality of the joint. {\textcopyright} 1986 Chapman and Hall Ltd.",

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note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

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journal = "Journal of Materials Science",

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T1 - Solid-state diffusion bonding of tungsten-25 rhenium alloy

AU - Nieh, T. G.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 1986/7

Y1 - 1986/7

N2 - Nickel has successfully been used as an interleaf material to join W-25Re between 900 and 1400° C. The bond strength was found to depend on the temperature and stress at which the bonding process was conducted. It was also found that nickel reacts with the parent metal and forms a Ni-W-Re ternary alloy. The formation of the alloy causes significant embrittlement in the parent material. The alloy first nucleates at the grain boundary and then grows into the grain. Quantitative studies of the growth kinetics of the ternary alloy and its effect on the bond strength are discussed. Joining of W-25Re by self-diffusion bonding has also been successfully demonstrated at temperatures above 1500° C. The effect of surface conditions will be correlated with the quality of the joint. © 1986 Chapman and Hall Ltd.

AB - Nickel has successfully been used as an interleaf material to join W-25Re between 900 and 1400° C. The bond strength was found to depend on the temperature and stress at which the bonding process was conducted. It was also found that nickel reacts with the parent metal and forms a Ni-W-Re ternary alloy. The formation of the alloy causes significant embrittlement in the parent material. The alloy first nucleates at the grain boundary and then grows into the grain. Quantitative studies of the growth kinetics of the ternary alloy and its effect on the bond strength are discussed. Joining of W-25Re by self-diffusion bonding has also been successfully demonstrated at temperatures above 1500° C. The effect of surface conditions will be correlated with the quality of the joint. © 1986 Chapman and Hall Ltd.

UR - https://www.scopus.com/pages/publications/0022756377

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0022756377&origin=recordpage

U2 - 10.1007/BF01114275

DO - 10.1007/BF01114275

M3 - RGC 21 - Publication in refereed journal

SN - 0022-2461

VL - 21

SP - 2327

EP - 2334

JO - Journal of Materials Science

JF - Journal of Materials Science

IS - 7

ER -

Solid-state diffusion bonding of tungsten-25 rhenium alloy

Abstract

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