Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

12 Scopus Citations
View graph of relations

Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)61-63
Journal / PublicationApplied Physics Letters
Volume71
Issue number1
Publication statusPublished - 7 Jul 1997
Externally publishedYes

Abstract

In the soldering reaction at 200°C between eutectic SnPb and plated Pd/Ni on Cu leadframes, two thicknesses of Pd of 760 and 2500 Å were used. Even very thin Pd can lead to continuous spreading of the solder on the leadframe; no stable wetting angle can be observed. Anisotropic spreading and spike formation were found due to the mechanical effect of rolling of the leadframe, and they are more pronounced in the thinner Pd samples. In the interfacial reaction, we have observed the formation of a ternary Pd-Ni-Sn compound and Ni3Sn4. While spalling of the ternary compound occurs, no spalling of the Ni3Sn4 was found. The latter forms a rather uniform layer consisting of small scallop-type grains. We found that the growth rate of Ni3Sn4 is much slower, by a factor of about 10, than that of Cu6Sn5 in the reaction between Cu and eutectic SnPb. © 1997 American Institute of Physics.

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to lbscholars@cityu.edu.hk.

Citation Format(s)

Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe. / Kim, P. G.; Tu, K. N.; Abbott, D. C.

In: Applied Physics Letters, Vol. 71, No. 1, 07.07.1997, p. 61-63.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review