TY - CHAP
T1 - Solder Reactions on Nickel, Palladium, and Gold
AU - Tu, King-Ning
PY - 2007
Y1 - 2007
N2 - In this chapter we shall discuss solder reaction with Ni, Pd, and Au. These metals and Cu are being used in under-bump metallization (UBM) or in bond pad, yet the role of Cu and Ni differs from that of Pd and Au. For Cu and Ni, the formation of intermetallic compound (IMC) of Cu-Sn or Ni-Sn is chosen so as to achieve metallic bonds in a solder joint. For Pd and Au, they have been used as surface coating to passivate the surface of Cu and Ni as well as to enhance wetting reaction. Typically, the surface of Cu is protected by a thin film of Au and that of Ni is protected by a film of Pd. Often Au is used on Ni too. © 2007 Springer Science+Business Media, LLC
AB - In this chapter we shall discuss solder reaction with Ni, Pd, and Au. These metals and Cu are being used in under-bump metallization (UBM) or in bond pad, yet the role of Cu and Ni differs from that of Pd and Au. For Cu and Ni, the formation of intermetallic compound (IMC) of Cu-Sn or Ni-Sn is chosen so as to achieve metallic bonds in a solder joint. For Pd and Au, they have been used as surface coating to passivate the surface of Cu and Ni as well as to enhance wetting reaction. Typically, the surface of Cu is protected by a thin film of Au and that of Ni is protected by a film of Pd. Often Au is used on Ni too. © 2007 Springer Science+Business Media, LLC
KW - Eutectic SnPb
KW - Eutectic SnPb Solder
KW - Molten Solder
KW - Solder Bump
KW - Solder Joint
UR - https://www.scopus.com/pages/publications/84876945760
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84876945760&origin=recordpage
U2 - 10.1007/978-0-387-38892-2_7
DO - 10.1007/978-0-387-38892-2_7
M3 - Chapter in research book/monograph/textbook (Author)
SN - 978-0-387-38890-8
SN - 978-1-4419-2284-7
T3 - Springer Series in Materials Science
SP - 183
EP - 208
BT - Solder Joint Technology
PB - Springer
CY - New York, NY
ER -