Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性

张亮; K N Tu; 孙磊; 郭永环; 何成文

Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性

Translated title of the contribution: Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders

张亮^*
, K N Tu
, 孙磊
, 郭永环
, 何成文

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

5 Citations (Scopus)

Abstract

Effect of Sb on the wettability of Sn-0.3Ag-0.7Cu lead-free solders was investigated, with different atmospheres and fluxes, the wetting balance tester was used to analyze the wettability of Sn-0.3Ag-0.7Cu-xSb solders. The results indicates that small amount of Sb can enhance the wettability of Sn-0.3Ag-0.7Cu solders. With the N₂ atmosphere, the wettability of Sn-0.3Ag-0.7Cu-xSb can be increased obviously, which can be attributed to the resistance of oxidation (molten solder). Combing different fluxes, the wettability of lead-free solder can represent variation, the suitable flux can improve the wettability of Sn-0.3Ag-0.7Cu-xSb solders.

Translated title of the contribution	Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders
Original language	Chinese (Simplified)
Pages (from-to)	59-62
Journal	Hanjie Xuebao/Transactions of the China Welding Institution
Volume	36
Issue number	1
Publication status	Published - 25 Jan 2015
Externally published	Yes

Research Keywords

Atmosphere
Flux
Lead-free solders
Wettability
无铅钎料曰
润湿性曰
氛围曰
钎剂

Access Output

http://hjxb.ijournals.cn/ch/reader/view_abstract.aspx?file_no=20150115

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@article{48a453802fd84ba0ac8f5112aad0319b,

title = "Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性",

abstract = "研究了微量Sb元素对Sn-0.3Ag-0.7Cu无铅钎料润湿性的影响, 采用润湿平衡法探讨了Sn-0.3Ag-0.7Cu-xSb钎料在不同氛围和不同钎剂条件下的润湿性能. 结果表明, 微量的Sb元素可以显著提高Sn-0.3Ag-0.7Cu无铅钎料润湿性. 在氮气氛围条件下, Sn-0.3Ag-0.7Cu-xSb钎料的润湿性得到显著改善, 主要基于氮气氛围减小熔融钎料的氧化. 辅助不同的钎剂, 钎料的润湿性差异较大, 选择合适的钎剂可以明显提高Sn-0.3Ag-0.7Cu-xSb钎料的润湿性.",

keywords = "Atmosphere, Flux, Lead-free solders, Wettability, 无铅钎料曰, 润湿性曰, 氛围曰, 钎剂, 無鉛釺料曰, 潤濕性曰, 氛圍曰, 釺劑",

author = "张亮 and Tu, \{K N\} and 孙磊 and 郭永环 and 何成文",

year = "2015",

month = jan,

day = "25",

language = "繁体中文",

volume = "36",

pages = "59--62",

journal = "Hanjie Xuebao/Transactions of the China Welding Institution",

issn = "0253-360X",

publisher = "Harbin Research Institute of Welding",

number = "1",

}

TY - JOUR

T1 - Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性

AU - 张亮, null

AU - Tu, K N

AU - 孙磊, null

AU - 郭永环, null

AU - 何成文, null

PY - 2015/1/25

Y1 - 2015/1/25

N2 - 研究了微量Sb元素对Sn-0.3Ag-0.7Cu无铅钎料润湿性的影响, 采用润湿平衡法探讨了Sn-0.3Ag-0.7Cu-xSb钎料在不同氛围和不同钎剂条件下的润湿性能. 结果表明, 微量的Sb元素可以显著提高Sn-0.3Ag-0.7Cu无铅钎料润湿性. 在氮气氛围条件下, Sn-0.3Ag-0.7Cu-xSb钎料的润湿性得到显著改善, 主要基于氮气氛围减小熔融钎料的氧化. 辅助不同的钎剂, 钎料的润湿性差异较大, 选择合适的钎剂可以明显提高Sn-0.3Ag-0.7Cu-xSb钎料的润湿性.

AB - 研究了微量Sb元素对Sn-0.3Ag-0.7Cu无铅钎料润湿性的影响, 采用润湿平衡法探讨了Sn-0.3Ag-0.7Cu-xSb钎料在不同氛围和不同钎剂条件下的润湿性能. 结果表明, 微量的Sb元素可以显著提高Sn-0.3Ag-0.7Cu无铅钎料润湿性. 在氮气氛围条件下, Sn-0.3Ag-0.7Cu-xSb钎料的润湿性得到显著改善, 主要基于氮气氛围减小熔融钎料的氧化. 辅助不同的钎剂, 钎料的润湿性差异较大, 选择合适的钎剂可以明显提高Sn-0.3Ag-0.7Cu-xSb钎料的润湿性.

KW - Atmosphere

KW - Flux

KW - Lead-free solders

KW - Wettability

KW - 无铅钎料曰

KW - 润湿性曰

KW - 氛围曰

KW - 钎剂

KW - 無鉛釺料曰

KW - 潤濕性曰

KW - 氛圍曰

KW - 釺劑

UR - https://www.scopus.com/pages/publications/84925883090

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84925883090&origin=recordpage

M3 - RGC 21 - Publication in refereed journal

SN - 0253-360X

VL - 36

SP - 59

EP - 62

JO - Hanjie Xuebao/Transactions of the China Welding Institution

JF - Hanjie Xuebao/Transactions of the China Welding Institution

IS - 1

ER -

Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性

Abstract

Research Keywords

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this