Size-dependent fracture behavior of silver nanowires
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
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Related Research Unit(s)
Detail(s)
Original language | English |
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Article number | 295703 |
Journal / Publication | Nanotechnology |
Volume | 29 |
Issue number | 29 |
Online published | 16 May 2018 |
Publication status | Published - 20 Jul 2018 |
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Abstract
Silver (Ag) nanowires have great potential to be used in the flexible electronics industry for their applications in flexible, transparent conductors due to high conductivity and light reflectivity. Those applications always involve mechanical loading and deformations, which requires an in-depth understanding of their mechanical behavior and performance under loadings. However, current understanding on the mechanical properties of Ag nanowires is limited, especially on their size-dependent fracture behavior. In this work, mechanical properties of Ag nanowires with diameters ranging from 50 to 300 nm were systematically studied by in situ TEM tensile testing for the first time. The size effect was clearly found, with the increasing of the diameter of Ag nanowires, the ultimate tensile stress decreased. More importantly, the fracture behavior of Ag nanowire was studied and a brittle-to-ductile transition in fracture behavior was observed at the diameters around 100 nm which could be attributed to the dislocation activities within the geometry confinement. This work could give insights for understanding nanosized Ag wires and the design of Ag nanowire-based flexible devices and touchable panels.
Research Area(s)
- Ag nanowire, fracture, in situ TEM, size effect, tensile testing
Citation Format(s)
Size-dependent fracture behavior of silver nanowires. / Cao, Ke; Han, Ying; Zhang, Hongti et al.
In: Nanotechnology, Vol. 29, No. 29, 295703, 20.07.2018.
In: Nanotechnology, Vol. 29, No. 29, 295703, 20.07.2018.
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review