TY - GEN
T1 - Simulation results of uniaxial micromirrors with conic-backside and V-arm flexures for scanner and display applications
AU - SUN, Winston
AU - ZHAN, Shaodong
AU - QIU, Yihang
AU - HU, Jianmin
AU - ZHANG, Guanglie
PY - 2018/7
Y1 - 2018/7
N2 - Performance simulations of uniaxial micromirrors with 1)conic backside to enhance flatness and 2)V-shaped suspension arms to reduce torsional stress and suppress unwanted sideways resonance modes are presented in this paper. Initial results indicate that circular and rounded-rectangular micromirrors with the V-arm flexures can resonate at 16.7 kHz and 3.2 kHz, respectively. Dynamic mirror warpages of about 100 nm is in accordance with the λ/4 criteria for visible light. At ±30° mirror deflections, besides having rounded junctions, the length and width of the flexures are adjusted such that the maximum stress is only about 1/3 the fracture strength of silicon. As the resonances are excited externally, and also with the acceptable reflectivity of silicon under the visible spectrum, the conductive wiring patterns and the reflective metal layer can both be omitted. In addition, since a single photomask can realize conic mirror backside, the microfabrication cost can be further reduced. We are confident that an assembly of these two uniaxial micromirrors on a 3D optical bench can generate high precision yet economical 2D microscanners for display applications.
AB - Performance simulations of uniaxial micromirrors with 1)conic backside to enhance flatness and 2)V-shaped suspension arms to reduce torsional stress and suppress unwanted sideways resonance modes are presented in this paper. Initial results indicate that circular and rounded-rectangular micromirrors with the V-arm flexures can resonate at 16.7 kHz and 3.2 kHz, respectively. Dynamic mirror warpages of about 100 nm is in accordance with the λ/4 criteria for visible light. At ±30° mirror deflections, besides having rounded junctions, the length and width of the flexures are adjusted such that the maximum stress is only about 1/3 the fracture strength of silicon. As the resonances are excited externally, and also with the acceptable reflectivity of silicon under the visible spectrum, the conductive wiring patterns and the reflective metal layer can both be omitted. In addition, since a single photomask can realize conic mirror backside, the microfabrication cost can be further reduced. We are confident that an assembly of these two uniaxial micromirrors on a 3D optical bench can generate high precision yet economical 2D microscanners for display applications.
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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85064990240&origin=recordpage
U2 - 10.1109/CYBER.2018.8688234
DO - 10.1109/CYBER.2018.8688234
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 978-1-5386-7057-6
T3 - Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER
SP - 293
EP - 296
BT - Proceedings of 2018 IEEE 8th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems
PB - IEEE
T2 - 8th Annual IEEE International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, IEEE-CYBER 2018
Y2 - 19 July 2018 through 23 July 2018
ER -
