Side wall wetting induced void formation due to small solder volume in microbumps of Ni/SnAg/Ni upon reflow

Y. C. Liang; C. Chen; K. N. Tu

doi:10.1149/2.002204ssl

Side wall wetting induced void formation due to small solder volume in microbumps of Ni/SnAg/Ni upon reflow

Y. C. Liang
, C. Chen^*
, K. N. Tu

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

51 Citations (Scopus)

Abstract

A processing failure of void formation has been observed in 3D IC microbumps due to small solder volume. We prepared the sandwiched Ni/Sn2.3Ag/Ni microbumps with 4 μm and 11 μm thick solders and reflowed them at 260°C to study the mechanism of void formation in the processing. Due to the thin solder, intermetallic compound formation of Ni₃Sn₄ from the two interfaces of the solder joint can physically bridge each other. When that happens, the degree of freedom of motion in the direction normal to the interfaces is removed. Consequently, when the remaining molten solder is drained by side wall reaction, large voids form in the joint. This is a unique mode of processing failure because of the smaller and smaller volume of solder joints in the trend of miniaturization. © 2012 The Electrochemical Society.

Original language	English
Pages (from-to)	P60-P62
Journal	ECS Solid State Letters
Volume	1
Issue number	4
DOIs	https://doi.org/10.1149/2.002204ssl
Publication status	Published - 2012
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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@article{4b77ecb0d0d841caba42ae4332db1d93,

title = "Side wall wetting induced void formation due to small solder volume in microbumps of Ni/SnAg/Ni upon reflow",

abstract = "A processing failure of void formation has been observed in 3D IC microbumps due to small solder volume. We prepared the sandwiched Ni/Sn2.3Ag/Ni microbumps with 4 μm and 11 μm thick solders and reflowed them at 260°C to study the mechanism of void formation in the processing. Due to the thin solder, intermetallic compound formation of Ni3Sn4 from the two interfaces of the solder joint can physically bridge each other. When that happens, the degree of freedom of motion in the direction normal to the interfaces is removed. Consequently, when the remaining molten solder is drained by side wall reaction, large voids form in the joint. This is a unique mode of processing failure because of the smaller and smaller volume of solder joints in the trend of miniaturization. {\textcopyright} 2012 The Electrochemical Society.",

author = "Liang, \{Y. C.\} and C. Chen and Tu, \{K. N.\}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

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doi = "10.1149/2.002204ssl",

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journal = "ECS Solid State Letters",

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TY - JOUR

T1 - Side wall wetting induced void formation due to small solder volume in microbumps of Ni/SnAg/Ni upon reflow

AU - Liang, Y. C.

AU - Chen, C.

AU - Tu, K. N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2012

Y1 - 2012

N2 - A processing failure of void formation has been observed in 3D IC microbumps due to small solder volume. We prepared the sandwiched Ni/Sn2.3Ag/Ni microbumps with 4 μm and 11 μm thick solders and reflowed them at 260°C to study the mechanism of void formation in the processing. Due to the thin solder, intermetallic compound formation of Ni3Sn4 from the two interfaces of the solder joint can physically bridge each other. When that happens, the degree of freedom of motion in the direction normal to the interfaces is removed. Consequently, when the remaining molten solder is drained by side wall reaction, large voids form in the joint. This is a unique mode of processing failure because of the smaller and smaller volume of solder joints in the trend of miniaturization. © 2012 The Electrochemical Society.

AB - A processing failure of void formation has been observed in 3D IC microbumps due to small solder volume. We prepared the sandwiched Ni/Sn2.3Ag/Ni microbumps with 4 μm and 11 μm thick solders and reflowed them at 260°C to study the mechanism of void formation in the processing. Due to the thin solder, intermetallic compound formation of Ni3Sn4 from the two interfaces of the solder joint can physically bridge each other. When that happens, the degree of freedom of motion in the direction normal to the interfaces is removed. Consequently, when the remaining molten solder is drained by side wall reaction, large voids form in the joint. This is a unique mode of processing failure because of the smaller and smaller volume of solder joints in the trend of miniaturization. © 2012 The Electrochemical Society.

UR - https://www.scopus.com/pages/publications/84880557691

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84880557691&origin=recordpage

U2 - 10.1149/2.002204ssl

DO - 10.1149/2.002204ssl

M3 - RGC 21 - Publication in refereed journal

SN - 2162-8742

VL - 1

SP - P60-P62

JO - ECS Solid State Letters

JF - ECS Solid State Letters

IS - 4

ER -

Side wall wetting induced void formation due to small solder volume in microbumps of Ni/SnAg/Ni upon reflow

Abstract

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