Shear deformation in the interphase region

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

4 Scopus Citations
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Author(s)

  • J. Wang
  • J. E. Dove
  • M. S. Gutierrez
  • J. D. Corton

Detail(s)

Original languageEnglish
Title of host publicationPowders and Grains 2005 - Proceedings of the 5th International Conference on Micromechanics of Granular Media
Pages747-750
Volume2
Publication statusPublished - 2005
Externally publishedYes

Publication series

Name
Volume2

Conference

Title5th International Conference on the Micromechanics of Granular Media: Powders and Grains 2005
PlaceGermany
CityStuttgart
Period18 - 22 July 2005

Abstract

Discrete element method simulations were used to model systems of densely-packed spherical particles contacting rough manufactured surfaces within an interface shear box. The manufactured surface consists of triangular asperities with constant height. Simulation variables include sample height, asperity slope and particle size. Results show that before peak stress state, the entire granular assemblage deforms in a pure shear mode. Near peak state, a fully plastic region emerges within the interphase located near the manufactured surface. It is shown that the maximum thickness of the shear band is reached at a model height of 35 mm. However, the overall deformation pattern remains the same regardless of model height. Maximum shear band thickness occurs in well-graded particle systems with asperity slopes of approximately 34 degrees and asperity height equal to the grain diameter. © 2005 Taylor & Francis Group.

Citation Format(s)

Shear deformation in the interphase region. / Wang, J.; Dove, J. E.; Gutierrez, M. S. et al.
Powders and Grains 2005 - Proceedings of the 5th International Conference on Micromechanics of Granular Media. Vol. 2 2005. p. 747-750.

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review