Shallow Junction Formation by Epitaxial Cobalt Silicide as Diffusion Source
Research output: Conference Papers › RGC 32 - Refereed conference paper (without host publication) › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
Original language | English |
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Pages | 347-350 |
Publication status | Published - Nov 1994 |
Conference
Title | 3rd International Conference on Materials and Process Characterization for VLSI (ICMPC '94) |
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Place | China |
City | Kunming |
Period | 7 - 11 November 1994 |
Link(s)
Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(180efee9-71bf-4108-ae2b-24c593351e6b).html |
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Bibliographic Note
Author(s) and Research Unit(s) information for this publication are provided by the author(s) concerned.
Citation Format(s)
Shallow Junction Formation by Epitaxial Cobalt Silicide as Diffusion Source. / Fang, Hua ; Li, Bing-Zong; Shao, Kai et al.
1994. 347-350 Paper presented at 3rd International Conference on Materials and Process Characterization for VLSI (ICMPC '94)
, Kunming , China.
1994. 347-350 Paper presented at 3rd International Conference on Materials and Process Characterization for VLSI (ICMPC '94)
, Kunming , China.
Research output: Conference Papers › RGC 32 - Refereed conference paper (without host publication) › peer-review