Self-healing of low angle grain boundaries by vacancy diffusion and dislocation climb

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Pages (from-to)155-159
Journal / PublicationScripta Materialia
Online published29 Jun 2018
Publication statusPublished - Oct 2018
Externally publishedYes


A new analytical model was developed to quantify the role of dislocation climb assisted by vacancy pipe and bulk diffusion in controlling the damage resistance and self-healing of perturbed low angle grain boundaries. Dislocation climb assisted by vacancy pipe diffusion predominantly controls the self-healing process at lower temperatures, while that assisted by bulk diffusion becomes important only at higher temperatures. A relaxation time for the perturbed grain boundary structure was also derived to quantify the time associated with the self-healing process. The extent of this self-healing increases with decreasing grain size, which explains the enhanced damage resistance of nanocrystalline materials.

Research Area(s)

  • Bulk diffusion, Dislocation climb, Dislocation dynamics, Grain boundaries, Pipe diffusion