Self-thickening, cross-slip deformation twinning model

J. Narayan, Y. T. Zhu

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

51 Citations (Scopus)

Abstract

We propose a cross-slip deformation twinning model based upon our experimental in situ deformation of Cu-Ge alloys using a transmission electron microscope. During the deformation, Shockley partials are emitted from the grain boundaries, which encounter an obstacle within the grain and split to nucleate deformation twins in the cross slip as well as primary planes. Upon further deformation a thickening process for twins is directly observed. The proposed model provides a dislocation mechanism for the observed simultaneous twin thickening in both the cross-slip and primary planes. The role of the proposed mechanism in the deformation of nanocrystalline materials is discussed. © 2008 American Institute of Physics.
Original languageEnglish
Article number151908
JournalApplied Physics Letters
Volume92
Issue number15
Online published15 Apr 2008
DOIs
Publication statusPublished - Apr 2008
Externally publishedYes

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