Selenium substitution for dielectric constant improvement and hole-transfer acceleration in non-fullerene organic solar cells

Xinjun He, Feng Qi, Xinhui Zou, Yanxun Li, Heng Liu, Xinhui Lu, Kam Sing Wong*, Alex K.-Y. Jen*, Wallace C. H. Choy*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

19 Citations (Scopus)
25 Downloads (CityUHK Scholars)

Abstract

Dielectric constant of non-fullerene acceptors plays a critical role in organic solar cells in terms of exciton dissociation and charge recombination. Current acceptors feature a dielectric constant of 3-4, correlating to relatively high recombination loss. We demonstrate that selenium substitution on acceptor central core can effectively modify molecule dielectric constant. The corresponding blend film presents faster hole-transfer of ~5 ps compared to the sulfur-based derivative (~10 ps). However, the blends with Se-acceptor also show faster charge recombination after 100 ps upon optical pumping, which is explained by the relatively disordered stacking of the Se-acceptor. Encouragingly, dispersing the Se-acceptor in an optimized organic solar cell system can interrupt the disordered aggregation while still retain high dielectric constant. With the improved dielectric constant and optimized fibril morphology, the ternary device exhibits an obvious reduction of non-radiative recombination to 0.221 eV and high efficiency of 19.0%. This work unveils heteroatom-substitution induced dielectric constant improvement, and the associated exciton dynamics and morphology manipulation, which finally contributes to better material/device design and improved device performance. © The Author(s) 2024.
Original languageEnglish
Article number2103
JournalNature Communications
Volume15
Online published7 Mar 2024
DOIs
Publication statusPublished - 2024

Funding

W.C.H.C. thanks the Research Grant Council of Hong Kong for the General Research Fund (Grant Nos. 17211220, 17200021, and 17200823), Collaboration Research Fund (C7035-20G), Innovation and Technology Commission of Hong Kong for the Innovation and Technology Fund (ITS/277/21FP), and University Grant Council of the University of Hong Kong for the seed fund (Grant Nos. 202011159254 and 202111159113). A.K.-Y.J. thanks the Innovation and Technology Commission of Hong Kong for the Innovation and Technology Fund (MRP/040/21X). K.S.W. thanks the Research Grant Council of Hong Kong for the Collaboration Research Fund (C6013-19G).

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