TY - GEN
T1 - Routing in optical network-on-chip
T2 - 24th Asia and South Pacific Design Automation Conference, ASPDAC 2019
AU - Li, Mengquan
AU - Liu, Weichen
AU - Yang, Lei
AU - Chen, Peng
AU - Liu, Duo
AU - Guan, Nan
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2019/1/21
Y1 - 2019/1/21
N2 - Communication contention and thermal susceptibility are two potential issues in optical network-on-chip (ONoC) architecture, which are both critical for ONoC designs. However, minimizing conflict and guaranteeing thermal reliability are incompatible in most cases. In this paper, we present a routing criterion in the network level. Combined with device-level thermal tuning, it can implement thermal-reliable ONoC. We further propose two routing approaches (including a mixed-integer linear programming (MILP) model and a heuristic algorithm (CAR)) to minimize communication conflict based on the guaranteed thermal reliability, and meanwhile, mitigate the energy overheads of thermal regulation in the presence of chip thermal variations. By applying the criterion, our approaches achieve excellent performance with largely reduced complexity of design space exploration. Evaluation results on synthetic communication traces and realistic benchmarks show that the MILP-based approach achieves an average of 112.73% improvement in communication performance and 4.18% reduction in energy overhead compared to state-of-the-art techniques. Our heuristic algorithm only introduces 4.40% performance difference compared to the optimal results and is more scalable to large-size ONoCs.
AB - Communication contention and thermal susceptibility are two potential issues in optical network-on-chip (ONoC) architecture, which are both critical for ONoC designs. However, minimizing conflict and guaranteeing thermal reliability are incompatible in most cases. In this paper, we present a routing criterion in the network level. Combined with device-level thermal tuning, it can implement thermal-reliable ONoC. We further propose two routing approaches (including a mixed-integer linear programming (MILP) model and a heuristic algorithm (CAR)) to minimize communication conflict based on the guaranteed thermal reliability, and meanwhile, mitigate the energy overheads of thermal regulation in the presence of chip thermal variations. By applying the criterion, our approaches achieve excellent performance with largely reduced complexity of design space exploration. Evaluation results on synthetic communication traces and realistic benchmarks show that the MILP-based approach achieves an average of 112.73% improvement in communication performance and 4.18% reduction in energy overhead compared to state-of-the-art techniques. Our heuristic algorithm only introduces 4.40% performance difference compared to the optimal results and is more scalable to large-size ONoCs.
UR - https://www.scopus.com/pages/publications/85061119898
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85061119898&origin=recordpage
U2 - 10.1145/3287624.3287650
DO - 10.1145/3287624.3287650
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 9781450360074
T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
SP - 400
EP - 405
BT - ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference
PB - IEEE
Y2 - 21 January 2019 through 24 January 2019
ER -