Root-of-area formula of electrical capacitance, for equivalent circuit of thermal conduction, from an HBT-IC through a GaAs substrate with temperature dependent conductivity
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
Original language | English |
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Title of host publication | Antem/URSI 2004 - 10th International Symposium on Antenna Technology and Applied Electromagnetics and URSI Conference, Proceedings |
Publisher | Institute of Electrical and Electronics Engineers, Inc. |
ISBN (print) | 9780969256397 |
Publication status | Published - 21 Feb 2017 |
Conference
Title | 10th International Symposium on Antenna Technology and Applied Electromagnetics and URSI Conference, Antem/URSI 2004 |
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Place | Canada |
City | Ottawa |
Period | 20 - 23 July 2004 |
Link(s)
Abstract
Like the field computation of capacitance, thermal resistance from an ICs is normally done by simulating over a very large region of the device and substrate, in 3D and with very fine meshing. This is especially necessary in a temperature dependent substrate such as GaAs [1]. Through the root-of-area capacitance formula of the electrical equivalent, this paper shows that the tedious 3D fine meshing may be replaced by a simple equivalent circuit.
Citation Format(s)
Root-of-area formula of electrical capacitance, for equivalent circuit of thermal conduction, from an HBT-IC through a GaAs substrate with temperature dependent conductivity. / Chow, Y. L.; Tsang, K. F.; Ping, S. W.
Antem/URSI 2004 - 10th International Symposium on Antenna Technology and Applied Electromagnetics and URSI Conference, Proceedings. Institute of Electrical and Electronics Engineers, Inc., 2017. 7860590.
Antem/URSI 2004 - 10th International Symposium on Antenna Technology and Applied Electromagnetics and URSI Conference, Proceedings. Institute of Electrical and Electronics Engineers, Inc., 2017. 7860590.
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review